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Preparation method of meter-scale large single crystal high-index surface copper foil

A high-index, copper-foil technology, applied in the direction of single crystal growth, single crystal growth, chemical instruments and methods, etc., can solve the problems of inability to accurately obtain high crystal plane index single-crystal copper foil, high cost, small area, etc.

Active Publication Date: 2020-09-22
PEKING UNIV
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current commercialized single crystal metals are generally prepared by bulk crystal growth or thin film deposition on the substrate, which is expensive and has a small area, which cannot meet its needs in the substrate, target market, microelectronics industry, and traditional power transmission. Large-scale application requirements in the field
At the same time, it is also impossible to accurately obtain high crystal plane index single crystal copper foil for special purposes.

Method used

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  • Preparation method of meter-scale large single crystal high-index surface copper foil
  • Preparation method of meter-scale large single crystal high-index surface copper foil
  • Preparation method of meter-scale large single crystal high-index surface copper foil

Examples

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Embodiment 1

[0036] Example 1: A pre-oxidation protection of industrial-grade commercial polycrystalline copper foil, followed by annealing to prepare single crystal Cu(112), Cu(113), Cu(122), Cu(123), Cu(133), Cu(223), Cu(233), Cu(355) and other high-index surface methods include the following steps:

[0037] (1) Place the industrial-grade commercial polycrystalline copper foil without any surface treatment on the high-temperature-resistant substrate or in the interlayer of the high-temperature-resistant substrate, put it into a heating table, annealing furnace or chemical vapor deposition equipment, and Under the air atmosphere, start to raise the temperature, raise the temperature to 80°C-450°C, keep it for 1 minute-24 hours, and then cool down to room temperature to obtain pre-oxidized polycrystalline copper foil.

[0038] (2), placing the pre-oxidized polycrystalline copper foil on a high-temperature-resistant substrate or in a high-temperature-resistant substrate interlayer, put it i...

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Abstract

The invention provides a preparation method of a meter-scale large single crystal high-index surface copper foil. According to the method, commercial polycrystalline copper foil is used as a raw material, and a series of meter-scale large-single-crystal high-index-surface copper foils such as Cu (112), Cu (113), Cu (122), Cu (133), Cu (223), Cu (233), Cu (355) and other high-index surfaces are prepared by using a process of oxidation protection in advance and annealing. The method proposed by the invention can solve the problems that Cu (112), Cu (113), Cu (122), Cu (123), Cu (133), Cu (223),Cu (233), Cu (355) and other high-index surface single crystal copper foils are high in price and preparation cost, and no product is supplied on the market. Macro preparation of high-quality meter-scale large single crystal Cu (112), Cu (113), Cu (122), Cu (123), Cu (133), Cu (223), Cu (233), Cu (355) and other high-index surface copper foils is realized through a very simple method.

Description

technical field [0001] The invention relates to a method for preparing a series of meter-level large single-crystal high-index surface copper foils in large quantities by using industrial-grade copper foils based on pre-oxidation protection. Background technique [0002] Single crystal copper foil exhibits many unusual electrical, mechanical, adsorption, and catalytic properties due to its smooth surface without grain boundaries and strong anisotropy. For example, single crystal Cu has lower resistance and AC impedance than polycrystalline Cu. The important reason is that electron scattering occurs at the grain boundary of polycrystalline Cu. This excellent electrical property makes it suitable for traditional power transmission and the new generation of electronics industry The field has very broad market prospects; single crystal superalloys have better creep resistance because they avoid grain boundary slip; in addition, single crystal surfaces, especially large-area sing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B29/02C30B29/64C30B1/02
CPCC30B1/02C30B29/02C30B29/64
Inventor 刘开辉吴慕鸿张志斌俞大鹏王恩哥
Owner PEKING UNIV
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