Wafer id reading device
A technology for reading devices and wafers, which is applied in the direction of workpiece clamping devices, instruments, induction recording carriers, etc., and can solve the problems of high space requirements, high cost, and long time consumption
Active Publication Date: 2021-03-30
HANGZHOU CHANGCHUAN TECH CO LTD
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] At present, most of the wafer ID reading devices disclosed in the relevant prior art are single-sided reading, that is, the camera can only read the image of the front or back of the wafer alone, and the wafer needs to be turned over adaptively when in use. so that the side with the wafer ID facing the camera takes a long time
However, some reading devices are equipped with two sets of cameras and corresponding two sets of lighting systems, which have higher requirements on the size of the space used, and the cost is also higher
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0035]referenceFigure 1 to 2As shown in the present invention, the wafer ID reading apparatus according to an embodiment of the present invention includes a first light source 1, a second light source 2, and a first reflective assembly 3 corresponding to the first light source 1 and the second light source 2, respectively. The second reflective assembly 4, the wafer ID read device further includes a selection component 5 and an imaging assembly 6.
[0036]among them:
[0037]The first light source 1 and the second light source 2 are opposite to the light lines of the wafer in both sides of the wafer;
[0038]The first reflective assembly 3 is used to reflect the light of the wafer side surface, and the second reflective assembly 4 is used to reflect the light of the other side surface of the wafer;
[0039]The selection assembly 5 includes a movable component that can be actively disposed in the wafer ID reading apparatus, and can select the light reflected in the first reflective assembly 3 or...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a wafer ID reading device. The device comprises a first light source, a second light source, a first light reflection assembly corresponding to the first light source, a second light reflection assembly corresponding to the second light source, a selection assembly and an imaging assembly, and the light emitting directions of the first light source and the second light source are opposite so that light can be irradiated to the two sides of a wafer respectively. The first light reflection assembly can reflect light reflected by the surface of one side of the wafer to the imaging assembly. The second light reflection assembly can reflect light reflected by the surface of the other side of the wafer to the imaging assembly. The selection assembly comprises a movable part; the movable part is movably arranged on the wafer ID reading device and can selectively reflect light reflected by one of the first light reflecting assembly and the second light reflecting assembly to the imaging assembly, the wafer ID reading device does not need to turn over a wafer in the whole wafer ID reading process, and operation is simple.
Description
Technical field[0001]The present invention relates to the field of integrated circuit testing, and in particular, to a wafer ID read device.Background technique[0002]Wafer refers to a silicon chip used in the production of silicon semiconductor integrated circuits, each of which has a number, a wafer ID (Wafer ID), in general, the wafer ID is printed on the front or reverse surface of the wafer. In the process of manufacturing a semiconductor device, an integrated circuit, an LCD panel, and the like, there are hundreds of processing equipment, corresponding to a large number of manufacturing flows. In these manufacturing processes, it is necessary to carry out the wafer to carry through the handling equipment. Therefore, in order to track the flow direction of the wafer, and the related information of the recording wafer, such as test results, etc., it is necessary to identify the wafer ID.[0003]At present, the wafer ID read device disclosed in the relevant prior art is mostly singl...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G06K7/10B25B11/00
CPCB25B11/00G06K7/10574
Inventor 陈夏薇郭剑飞姚建强陈思乡
Owner HANGZHOU CHANGCHUAN TECH CO LTD