Structure and formation method thereof

Abstract

A package structure and a formation method thereof are provided. The method includes forming a redistribution structure over a carrier substrate and disposing a semiconductor die over the redistribution structure. The method also includes stacking an interposer substrate over the redistribution structure. The interposer substrate extends across edges of the semiconductor die. The method further includes disposing one or more device elements over the interposer substrate. In addition, the method includes forming a protective layer to surround the semiconductor die.

Description

technical field [0001] Some embodiments of the present disclosure relate to semiconductor die packaging technology, in particular to a semiconductor die packaging structure and a method for forming the same. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced rapid growth. Due to the continuous advancement of semiconductor manufacturing process technology, semiconductor devices with finer features and / or higher integration are produced. Functional density (ie, the number of interconnected elements per chip area) has generally increased, while feature size (ie, the smallest feature that can be produced using a fabrication process) has shrunk. This size reduction process generally provides benefits through increased production efficiency and reduced manufacturing costs. [0003] Chip packages not only provide protection for semiconductor devices from environmental pollution, but also provide connection interfaces for semiconductor...

AI Technical Summary

Problems solved by technology

These relatively new semiconductor die packaging technologies currently face many manufacturing challenges

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