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Headphones

A technology for earphones and earphones, which is applied in stereo communication earphones, earphones/earphone accessories, earphone manufacturing/assembly, etc., and can solve the problems of increasing the overall volume of earphones, etc.

Active Publication Date: 2020-10-30
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, some headsets are difficult to transport easily without using a bulky case or by wearing them conspicuously around the neck when not in use
Conventional interconnects between earpieces and straps typically use a yoke around the perimeter of each earpiece, which adds to the overall bulk of each earpiece

Method used

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Embodiment Construction

[0122] Representative applications of methods and apparatus according to the present application are described in this section. These examples are provided only to add context and facilitate understanding of the described embodiments. It will therefore be apparent to one skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the embodiments. Other applications are possible such that the following examples should not be considered limiting.

[0123] In the following Detailed Description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments according to which embodiments are described. While these embodiments are described in sufficient detail to enable those skilled in the art to practice the described embodiments, it ...

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PUM

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Abstract

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Description

[0001] Cross references to related patent applications [0002] This patent application claims priority to U.S. Provisional Patent Application No. 62 / 651,634, filed April 2, 2018, the disclosure of which is incorporated herein by reference in its entirety for all purposes. technical field [0003] Embodiments described herein relate generally to various earphone features. More specifically, the various features help improve the overall user experience by incorporating sensor arrays and new mechanical features into the headset. Background technique [0004] Headphones are now more than 100 years old, but the design of the mechanical frame used to hold the earpiece snugly against the user's ear has stagnated somewhat. For this reason, some headsets are difficult to transport easily without using bulky cases or by wearing them visibly around the neck when not in use. Conventional interconnections between earpieces and straps typically use a yoke around the perimeter of each ...

Claims

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Application Information

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IPC IPC(8): H04R5/033
CPCH04R1/1058H04R2201/105H04R1/1066H04R5/0335H04R1/1041H04R1/1008H04R1/1075H04R1/1083H04R1/105H04R5/04
Inventor E·西亚汉D·R·布卢姆L·M·帕内基P·钱B·A·谢弗C·J·斯特林格E·A·黄D·H·那拉乔斯基S·Y·大下D·A·哈特菲尔德Z·G·西格雷夫S·J·多赫蒂
Owner APPLE INC