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A spring top block mold device for solving mold cavity jam

A jacking block and material jamming technology, which is applied in the field of spring jacking mold devices, can solve problems such as embossing and waste discharge, and achieve the effect of stable pressure and solving material jamming

Active Publication Date: 2022-03-29
郑州领胜科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In the present invention, a spring ejector mold device that solves the problem of material jam in the cavity can automatically eject the insert when the mold is opened by adding a spring device at the bottom of the insert mold, and then eject the product, thereby solving the problem of die-cutting. Problems such as material jam, waste discharge, embossing and film wrinkle, etc., and keep the overall pressure stable

Method used

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  • A spring top block mold device for solving mold cavity jam
  • A spring top block mold device for solving mold cavity jam

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Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0019] figure 1 Schematically shows the structure of a spring ejector mold device for solving mold cavity jam according to an embodiment of the present invention, figure 2 shown figure 1 A decomposition structure of the spring ejector mold device that solves the problem of material jam in the cavity. Such as Figure 1-2 As shown, the mold device includes a mold body 1 and a bottom plate 2 , the mold body 1 and the bottom plate 2 have the same cross-sectional size and are rectangular, and the mold body 1 is installed on the bottom plate 2 .

[0020] Preferably, a plurality of upper mounting holes 11 are distributed around the mold body 1, that is, on each corner and each side, and a plurality of lower mounting holes 21 are arranged on the bottom plate 2. The number and position of each lower mounting hole 21 Respectively opposite to each upper mounting ho...

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Abstract

The invention discloses a spring top block mold device for solving the problem of material jam in the mold cavity. The device includes a mold main body, the mold main body is installed on a bottom plate, and a knife edge is arranged on the surface of the mold main body; wherein, a plurality of springs are installed in the bottom plate, and each spring is respectively connected with a thimble and a thimble A block action column, the thimble and the ejector block action column both extend through the mold body to above the surface of the mold body and can slide, and the ejector pin is higher than the blade, and the ejector block action column above the thimble. In the present invention, a spring ejector mold device that solves the problem of material jam in the cavity can automatically eject the insert when the mold is opened by adding a spring device at the bottom of the insert mold, and then eject the product, thereby solving the problem of die-cutting. Problems such as material jam, waste discharge, embossing and film wrinkle, etc., and keep the overall pressure stable.

Description

technical field [0001] The invention relates to the field of molds, in particular to a spring ejector mold device for solving mold cavity material jam. Background technique [0002] In communication equipment, such as the mobile phone industry, the manufacture and installation of many of its components (such as speakers) are becoming more and more miniaturized and compact, and the corresponding die-cut products (such as waterproof and breathable membranes) in processing The size is also getting smaller, the shape is often very irregular, and there are often cases where multiple layers are stacked and processed at the same time. Therefore, when using traditional engraving molds and insert molds to process components, problems such as material jams, waste discharge, embossing, and film wrinkles often occur, and are often difficult to solve. Contents of the invention [0003] In order to solve the above problems, the present invention provides a spring ejector mold device th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26F1/44B26D7/18
CPCB26F1/44B26D7/1818
Inventor 杨岩陈天跃
Owner 郑州领胜科技有限公司
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