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Voltage adjustment method of load sensor

A technology of load sensor and voltage adjustment, which is used in the measurement of the properties of piezoelectric devices, instruments, parts of grinding machine tools, etc.

Pending Publication Date: 2020-11-17
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to pressurize the three load cells equally

Method used

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  • Voltage adjustment method of load sensor
  • Voltage adjustment method of load sensor
  • Voltage adjustment method of load sensor

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0023] 1 About the grinding device

[0024] figure 1 The illustrated polishing apparatus 1 is a polishing apparatus for polishing the wafer W held by the chuck table 2 by bringing the polishing member 341 into contact with it. Hereinafter, the polishing device 1 will be described.

[0025] like figure 1 As shown, the grinding device 1 has: a base 10 extending along the Y-axis direction; and a column 11 erected on the +Y direction side of the base 10 .

[0026] A chuck table 2 is provided on a base 10 of the grinding device 1 . The chuck table 2 is a disc-shaped table that holds the wafer W, and includes a suction unit 20 having a holding surface 20 a and a frame 21 that supports the suction unit 20 . With the wafer W placed on the holding surface 20a, suction force exerted by a suction source (not shown) is transmitted to the holding surface 20a, whereby the wafer W is sucked and held by the holding surface 20a.

[0027] A cover 12 is disposed around the chuck table 2 . ...

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PUM

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Abstract

Provided is a voltage adjustment method for a load sensor, which uses the load sensor to appropriately measure a load. The voltage adjustment unit (9) is adjusted (first to third adjustment steps) sothat the voltage values calculated by the measurer (8) are the same even when a load is applied to the vicinity of any of the first sensor (71), the second sensor (72), and the third sensor (73) on the chuck table (2). Furthermore, in the repeating step, the first to third adjustment steps are repeated. When the sensors (71-73) are subjected to a predetermined load, that is, when the sensors (71-73) are subjected to a predetermined load near the sensors (71-73) on the chuck table (2), the total voltage calculated by the measurer (8) can be equalized, and thus, the measured value of the load inthe measurer (8) can be equalized.

Description

technical field [0001] The invention relates to a voltage adjustment method of a load sensor. Background technique [0002] In order to strengthen the bending strength of the wafer, for example, grinding marks formed on the wafer by grinding with a grinding wheel are removed by a grinding process with a grinding pad. Polishing is performed by pressing a polishing pad against a wafer with a predetermined load. That is, the grinding removal amount changes according to the magnitude of the load. By performing grinding with the same load in a plurality of grinding devices, the amount of grinding removal can be made the same. [0003] For example, as disclosed in Patent Document 1, the load received by the wafer from the polishing pad is detected as follows. Load sensors made of piezoelectric elements are arranged at vertices of an equilateral triangle whose center of gravity is the center of the chuck table. The total value of the loads measured by these three load sensors i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/34B24B49/16
CPCB24B37/34B24B49/16G01L5/22G01L5/167G01L1/16
Inventor 久保徹雄
Owner DISCO CORP
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