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Nozzle arrangement and method for processing a material for processing with a processing medium

A nozzle device and nozzle technology, which are applied in the direction of liquid processing of printed circuits, devices for coating liquid on surfaces, electrical components, etc., can solve the problems of processing workstation loss, material loss to be processed, processing system blockage, etc., and achieve consumption and cost. Low, save processing steps, shorten the effect of processing time

Inactive Publication Date: 2010-10-13
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can lead to a situation where the material to be treated is scraped along the nozzle arrangement or completely caught in it, which leads to a loss of the material to be treated or a blockage inside the corresponding treatment system
In the case of such a blockage, production must be interrupted in order to clear the blockage, which in many cases results in a loss of other processing stations due to the longer processing times

Method used

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  • Nozzle arrangement and method for processing a material for processing with a processing medium
  • Nozzle arrangement and method for processing a material for processing with a processing medium
  • Nozzle arrangement and method for processing a material for processing with a processing medium

Examples

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Embodiment Construction

[0052] Figure 1A A nozzle arrangement according to one embodiment of the invention is shown, which is particularly suitable as a surge nozzle for an electroplating system with a horizontal run-through for printed circuit boards or printed circuit films. ). The nozzle arrangement comprises two nozzles extending along a conveying plane in which the material to be treated moves along a conveying path from an inlet area 15 to an outlet area 16 . The two nozzles are arranged directly opposite each other and mirror-symmetrically with respect to the conveying plane. A processing channel is arranged between the two nozzles, and the material to be processed can pass through the processing channel.

[0053] In each case, said nozzles comprise a housing 2 in which a nozzle opening 8 is arranged in the side facing the conveying plane. A treatment medium in the form of a treatment liquid for the treatment of the material to be treated is supplied to the nozzle through a connection openi...

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PUM

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Abstract

A nozzle arrangement is disclosed, for particular application as flushing nozzles in galvanising units with horizontal flow of a material (10) for processing, in the form of circuit boards. The material (10) for processing may thus be transported in a transport direction (18) from an entry region (15) to an exit region (16) of the nozzle arrangement. The nozzle arrangement comprises at least one nozzle opening (8), embodied such that a flow of a material (10) for processing runs at an inclined given angle to a transport plane of the material (10) for processing, such that the flow of the processing medium is diverted in the transport direction (18) of the material (10) for processing.

Description

technical field [0001] The invention relates to a nozzle arrangement and a method for treating a material to be treated with a treatment medium. In particular, the present invention relates to a surge nozzle arrangement such as may be used in traveling systems for wet chemical processing of very thin printed circuit films or printed circuit boards. Background technique [0002] Nozzle arrangements in the form of surge nozzles are used, for example, in traveling systems for the wet chemical treatment of printed circuit boards, so that the fastest and most efficient treatment of the material to be treated in the form of printed circuit boards or printed circuit films traveling through the system is possible. Uniform treatment. In this case, by arranging several surge nozzles above and / or below the plane of travel of the material to be treated, the nozzle arrangement extends transversely to the material to be treated substantially over its entire width. By means of the surge ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/00
CPCH05K1/0393H05K2203/1509H05K2203/0746H05K3/0085H05K2203/1572B05C5/02H05K3/14
Inventor 亨利·孔策费迪南德·维纳
Owner ATOTECH DEUT GMBH
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