Nozzle arrangement and method for processing a material for processing with a processing medium
A nozzle device and nozzle technology, which are applied to printed circuit liquid treatment, devices for coating liquid on the surface, electrical components, etc., can solve the problems of processing workstation loss, material loss to be processed, processing system blockage, etc., to achieve consumption and cost Low cost, saving of processing steps, and shortening of processing time
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0052] Figure 1A A nozzle arrangement according to one embodiment of the invention is shown, which is particularly suitable as a surge nozzle for an electroplating system with a horizontal run-through for printed circuit boards or printed circuit films. ). The nozzle arrangement comprises two nozzles extending along a conveying plane in which the material to be treated moves along a conveying path from an inlet area 15 to an outlet area 16 . The two nozzles are arranged directly opposite each other and mirror-symmetrically with respect to the conveying plane. A processing channel is arranged between the two nozzles, and the material to be processed can pass through the processing channel.
[0053] In each case, said nozzles comprise a housing 2 in which a nozzle opening 8 is arranged in the side facing the conveying plane. A treatment medium in the form of a treatment liquid for the treatment of the material to be treated is supplied to the nozzle through a connection opening...
PUM
![No PUM](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/noPUMSmall.5c5f49c7.png)
Abstract
Description
Claims
Application Information
![application no application](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/application.06fe782c.png)
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com