Chip test seat

A technology for chip testing and test sockets, which is applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve problems such as dust contamination, and achieve a wide range of applications

Pending Publication Date: 2020-12-01
成芯半导体(江苏)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a chip test socket, which is more flexible and convenient to complete the compression and fixing of the chip on the test socket, and can meet the requirements for testing chips of a certain range of sizes or different shapes. , to solve the problem that the test socket is exposed to dust in the air for a long time when it is not in use

Method used

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see Figure 1-6 , a chip test seat, including a test seat body 1, a support plate 2 is provided on the upper end of the test seat body 1, a vertical connection port 4 is provided on the outer surface of the support plate 2, and a fixed structure 3 is provided on one side of the support plate 2 , the fixed structure 3 includes a fixed shaft 31, a rotating tube 32, an upper connecting plate 33, a spring 34, a lower connecting plate 35, a pulling plate 36 ...

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Abstract

The invention relates to the field of charging equipment. The invention further discloses a chip test seat which comprises a test seat body, the upper end of the test seat body is provided with a supporting plate, a vertical connecting opening is formed in the outer surface of the supporting plate; a fixing structure is arranged on one side of the supporting plate, and the fixing structure comprises a fixing shaft, a rotating pipe, an upper connecting plate, a spring, a lower connecting plate, a pulling plate and a limiting block, a dustproof shell is arranged on one side of the supporting plate, a vertical connecting strip is arranged on the outer surface of one side of the dustproof shell, and a transverse connecting strip is arranged at the lower end of the dustproof shell. According tothe chip test seat, the chip can be flexibly and conveniently pressed and fixed on the test seat, the requirement for testing chips with certain range sizes or different shapes can be met, the problem that the test seat is exposed to air for a long time to be contaminated by dust when not used is solved, and therefore, a better using prospect is brought to the field of chip testing.

Description

technical field [0001] The invention relates to the field of chip testing, in particular to a chip testing seat. Background technique [0002] With the rapid development of science and technology and the improvement of people's living standards, the development of chips in electronics is getting deeper and deeper, and chips need to be tested before they are used in order to avoid unnecessary losses caused by chips that do not meet the requirements for use. The chip test socket has therefore become an indispensable equipment in the chip production process. [0003] There are certain disadvantages in the use of the existing chip test sockets. First, the chip test sockets cannot conveniently complete the pressing and fixing of the chips on the test sockets, which is not conducive to the adjustment and fixation of the test sockets, and may easily cause inaccurate tests. Secondly, it is often only possible to test a single corresponding chip, not a certain range of sizes or diff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/04
CPCG01R1/0408G01R31/2851
Inventor 邓佳佳
Owner 成芯半导体(江苏)有限公司
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