Ultrasonic lateral ring array transceiver

An ultrasonic and transceiver technology, applied in the field of ultrasonic lateral ring array transceivers, can solve the problems of low integration and complex structure, and achieve the effects of improving integration, simplifying structure, and realizing miniaturized design.

Pending Publication Date: 2020-12-29
SONOSEMI MEDICAL CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present application provides an ultrasonic lateral ring array transceiver, which can solve the problems of complex structure and low integration of traditional ultrasonic transducers

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  • Ultrasonic lateral ring array transceiver
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  • Ultrasonic lateral ring array transceiver

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Embodiment Construction

[0032] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0033] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude one or more other Presence or addition of features, wholes, steps, operations, elements, components and / or collections thereof.

[0034] It should...

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Abstract

The invention is applicable to the technical field of ultrasonic imaging and provides an ultrasonic lateral ring array transceiver which comprises a transceiver chip and transduction array chips. Thepackaging shape of the transceiver chip is a cylinder, and the transduction array chips are annularly arranged on the side surface of the transceiver chip. The transceiver chip is electrically connected with the transduction array chips and a host in ultrasonic imaging equipment respectively. The transceiver chip drives the transduction array chips to send ultrasonic waves to the vertical direction of the side surface of the transceiver chip according to an excitation signal of the host. The transduction array chips generate a corresponding imaging electric signal according to a returned ultrasonic wave and transmits the imaging electric signal to the transceiver chip. The transceiver chip also conducts low-noise signal amplification on the imaging electric signal and sends the amplified imaging electric signal to the host. The transceiver chip and the transduction array chips in the ultrasonic lateral ring array transceiver are all integrated semiconductor chips, so that the structureof the ultrasonic lateral ring array transceiver is simplified, the integration level is improved, and the miniaturization design can be achieved.

Description

technical field [0001] The application belongs to the technical field of ultrasonic imaging, and in particular relates to an ultrasonic lateral ring array transceiver. Background technique [0002] With the rapid development of science and technology, ultrasonic technology and computer technology have been closely integrated, which has promoted the wide application of ultrasonic detection and ultrasonic echo imaging technology in medical, industrial, aerospace, automotive, consumer electronics and other fields. Compared with other imaging technologies, medical ultrasound has unique advantages such as good real-time performance, no damage, no pain, no ionizing radiation, and low cost. It is currently widely used in clinical examination and diagnosis, and is favored by medical workers and patients welcome. [0003] Ultrasonic transducers (also known as ultrasonic probes) are one of the key components of medical ultrasound imaging equipment, and their characteristics directly ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/02A61B8/00
CPCA61B8/4483B06B1/0215B06B2201/76
Inventor 刘斌
Owner SONOSEMI MEDICAL CO LTD
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