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Server heat dissipation device and adjusting method thereof

A technology for cooling devices and servers, which is applied in the fields of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of reducing the dust-proof effect of servers and poor dust-proof effect, etc.

Active Publication Date: 2021-01-26
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the server also has dust-proof and electrical safety requirements, otherwise there is no need to install a chassis, and the cooling holes will reduce the dust-proof effect of the server. The more cooling holes are installed, the The worse the dustproof effect

Method used

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  • Server heat dissipation device and adjusting method thereof
  • Server heat dissipation device and adjusting method thereof
  • Server heat dissipation device and adjusting method thereof

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Embodiment Construction

[0039] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0040] Such as Figure 1-4 As shown, the embodiment of the present invention provides a server heat dissipation device, including a chassis shell 1, a cover plate 2, an adjustment mechanism 3 and a controller 4, the chassis shell 1 is provided with a plurality of cooling holes 11 at intervals, and the cover The plate 2 is located on the side of the chassis shell 1 where the cooling holes 11 are provided and the cover plate 2 is slidably connected to the chassis shell 1, the cover plate 2 is connected to the adjustment mechanism 3, and the adjustment mechanism 3 is electrically connected to the controller 4. The controller 4 is connected with a temperature sensor 5 ,...

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Abstract

The invention provides a server heat dissipation device and an adjusting method thereof. The device comprises a case shell, a cover plate, an adjusting mechanism and a controller, a plurality of heatdissipation holes are formed in the case shell at intervals, the cover plate is located on the body side face, provided with the heat dissipation holes, of the case shell and is in sliding connectionwith the case shell, and the cover plate is connected with the adjusting mechanism; the adjusting mechanism is electrically connected with a controller, the controller is connected with a temperaturesensor, and the temperature sensor is arranged at the inner side of the case shell. The method comprises the steps of 1, setting a temperature control interval of a case in a controller; 2, measuringthe actual temperature in the case, and transmitting the actual temperature to a controller; 3, comparing the actual temperature with the temperature control interval; 4, if the actual temperature ishigher than a maximum control temperature, enabling the controller to control the adjusting mechanism to drive the cover plate to move so as to increase the number of unshielded heat dissipation holes; and if the actual temperature is lower than a minimum control temperature, using the controller to control the adjusting mechanism to drive the cover plate move so as to reduce the number of unshielded heat dissipation holes.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of server chassis, in particular to a server heat dissipation device and an adjustment method thereof. Background technique [0002] In the era of big data, servers are used more and more widely, and the performance requirements for servers are also getting higher and higher. Correspondingly, the heat dissipation performance of servers must be improved to meet the needs of servers that can calculate a large amount of data for a long time. Maintain stable operation, so that the server will not overheat and cause downtime. At present, in order to improve the heat dissipation efficiency of some servers in higher configurations, the upper cover of the chassis adopts the design of opening heat dissipation holes to speed up the exchange of external air and hot air inside the chassis, so as to achieve the purpose of improving the heat dissipation efficiency of the chassis. [0003] However, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F11/30
CPCG06F1/20G06F11/3058
Inventor 赵亮
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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