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Substrate carrier and air diffusion module thereof

A gas diffusion and carrier technology, which can be used in electrical components, semiconductor/solid-state device manufacturing, packaging of fragile items, etc., and can solve problems such as inconvenient replacement.

Pending Publication Date: 2021-01-29
GUDENG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And the design set inside the semiconductor container also makes it more inconvenient to replace

Method used

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  • Substrate carrier and air diffusion module thereof
  • Substrate carrier and air diffusion module thereof
  • Substrate carrier and air diffusion module thereof

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Embodiment Construction

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts all belong to the protection scope of the present invention.

[0036] In order to be able to understand the technical characteristics and practical effects of the present invention, and to implement it according to the contents of the description, the preferred embodiment shown in the drawings is further described in detail as follows:

[0037] Please also refer to figure 1 and figure 2 , figure 1 It is a schematic diagram of the structure and composition of the embodiment of the present invention; fi...

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Abstract

This invention proposes a substrate carrier and an air diffusion module thereof. The air diffusion module comprises a cover, at least one air inlet, an airtight layer, an air diffusion layer and an engaging portion. The at least one air inlet is connected with the cover, and the airtight layer is connected with the cover and the at least one air inlet. Furthermore, the air diffusion layer is connected with the cover via the airtight layer, and the engaging portion engages and tightly connected with the cover, the at least one air inlet and the air diffusion layer. The engaging portion is configured on the substrate carrier as a semiconductor container.

Description

technical field [0001] The invention relates to the technical field of cleaning technology related to semiconductor containers. In particular, it refers to a substrate carrier and its gas diffusion module that achieves a cleaning effect by creating a uniform flow of gas in a container through an air chamber. Background technique [0002] In the field of semiconductor technology, both the substrate (Substrate) and the mask (Reticle) are indispensable in the process. In view of the fact that the semiconductor structure is an extremely precise structure, the requirements for cleanliness in its manufacturing process are extremely limited. [0003] Among them, the substrate (Substrate) is an indispensable basic material for making all semiconductor components. It includes common silicon substrates (such as wafers), glass substrates, ceramic substrates and even sapphire substrates. In the general semiconductor component manufacturing process, the final microstructures produced ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
CPCH01L21/67393H01L21/67386H01L21/67376H01L21/67389H01L21/67379B65D85/30H01L21/67772H01L21/67766H01L21/67373H01L21/67017H01L21/67126H01L21/67769
Inventor 邱铭乾林志铭李柏廷褚育辰
Owner GUDENG PRECISION IND CO LTD