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Chip and its preparation method, electronic equipment

A technology for electronic equipment and chips, applied in circuits, electrical components, electrical solid devices, etc., to solve problems such as failure of bare chips and cracks in bare chips.

Active Publication Date: 2022-04-12
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a chip and its preparation method, and electronic equipment, which are used to solve the problem that cracks appear on the bare chip and lead to the failure of the bare chip

Method used

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  • Chip and its preparation method, electronic equipment
  • Chip and its preparation method, electronic equipment
  • Chip and its preparation method, electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0098] Such as Figure 3a As shown, the chip 20 includes a semiconductor substrate 21 and a circuit layer 250 with a circuit structure on the semiconductor substrate 21 ;

[0099] The circuit layer 250 includes a multi-layer first dielectric layer 212 and a multi-layer metal pattern layer 25 , and the metal pattern layer 25 constitutes the circuit structure of the chip 20 . There is a first dielectric layer 212 between two adjacent metal pattern layers 25 , and the first dielectric layer 212 is used to separate the metal pattern layers 25 located in different layers in the circuit layer 250 . The metal pattern layers 25 of different layers may be electrically connected through via holes on the first dielectric layer 212 .

[0100] In this case, it can be seen from the above that in order to achieve the above-mentioned function of blocking crack propagation at the interface between adjacent first dielectric layers 212, the chip 20 further includes a plurality of first The rei...

example 2

[0117] In this example, the chip 20 is a chip with an image sensing function, which is the same as Example 1 in that it includes the above circuit layer 250 with a circuit structure, and the difference is that it also includes a photosensitive device.

[0118] Such as Figure 8a As shown, the chip 20 includes a semiconductor substrate 21, a circuit layer 250 as described in Example 1 provided on the semiconductor substrate 21, a plurality of photosensitive devices 26 provided on the side of the circuit layer 250 away from the semiconductor substrate 21, and a plurality of photosensitive devices 26 provided on the side of the circuit layer 250 away from the semiconductor substrate 21. The second dielectric layer 222 on the side away from the semiconductor substrate 21 and the plurality of first stiffeners 24 .

[0119] In this case, the chip 20 includes a multi-layer dielectric layer including a second dielectric layer 222 and a multi-layer first dielectric layer 212 . The sec...

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PUM

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Abstract

The application provides a chip, a preparation method thereof, and electronic equipment, which relate to the field of chip technology and are used to solve the problem of cracks on the bare chip leading to failure of the bare chip. The chip includes a functional area and a non-functional area located on the periphery of the functional area. The chip includes: a semiconductor substrate; a multilayer dielectric layer disposed on the semiconductor substrate, and a part of the dielectric layer is located in the non-functional area; at least one first reinforcement , located in the non-functional area; the first reinforcing member is embedded in at least two dielectric layers, and the first reinforcing member is connected to the embedded dielectric layer.

Description

technical field [0001] The present application relates to the field of chip technology, and in particular to a chip, a manufacturing method thereof, and electronic equipment. Background technique [0002] An electronic system usually refers to an objective entity composed of electronic components or parts that can generate, transmit, collect or process electrical signals and information. With the in-depth development of informatization and intelligence, electronic systems are more and more widely used in mobile phones, computers, automotive electronics, industrial control and other electronic equipment. [0003] The core components in the electronic system are bare chips, and the stability of the bare chip structure determines the stability of the electronic system. However, in the prior art, when preparing the bare chip or packaging the bare chip, it is easy to crack between the film layers in the bare chip after being heated or pressed, or the film layer is broken, result...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L23/544H01L31/0203
CPCH01L23/562H01L23/564H01L22/32H01L31/0203H01L23/544H01L23/00H01L23/16
Inventor 杨帆马会财史洪宾
Owner HONOR DEVICE CO LTD