Equipment structure for taking and placing large-scale semiconductor printing plate

Abstract

The invention discloses an equipment structure for taking and placing a large semiconductor printing plate. The equipment structure comprises a Z-direction moving structure, a camera structure, a Y-direction moving structure, a U-direction rotating structure, a feeding platform structure and an X-direction moving structure; the feeding platform structure is used for achieving lifting of the feeding platform; the X-direction moving structure is used for realizing X-direction movement of a transfer platform; the Y-direction moving structure is used for realizing Y-direction movement of the transfer platform; the Z-direction moving structure is used for realizing Z-direction movement of the transfer platform; the U-direction rotating structure rotates by the rotating platform; and the camerastructure comprises a camera and a light source below the camera. A conductor printing plate taking and placing device is provided with the Z-direction moving structure, the camera structure, the Y-direction moving structure, the U-direction rotating structure, the feeding platform structure and the X-direction moving structure, movement of the transfer platform in the X direction, the Y direction, the Z direction and the U direction is achieved, moving and grabbing are conducted according to the positions of all material pieces in a material box, and automatic taking and placing of a printingplate are achieved; and the production efficiency is improved, and mistaken damage possibly caused by manual taking and placing is avoided.

Description

technical field [0001] The invention relates to a pick-and-place equipment, in particular to a pick-and-place equipment structure for a large semiconductor printed board. Background technique [0002] In the production process of semiconductors, part of the process involves the pick-and-place of large printed boards, that is, taking out or storing them from bins. If these tasks are completed manually, the efficiency is very low, and the labor cost and time cost are relatively high. Therefore, the present invention provides a mechanical structure that can be automatically stored. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the present invention provides a device structure for picking and placing large-scale semiconductor printed boards, which can be automatically picked and stored. [0004] The present invention provides following technical scheme: [0005] A device structure for picking and placing large-scale semiconducto...

AI Technical Summary

Problems solved by technology

If these tasks are completed manually, the efficiency is very low, and the labor cost and time cost a

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