Clamping structure for cleaning based on Internet of Things

A clamping structure and Internet of Things technology, applied in cleaning methods and appliances, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problem that the clamping structure cannot be remotely monitored

Active Publication Date: 2021-03-16
宁波润华全芯微电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing clamping structure does not allow remote monitoring

Method used

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  • Clamping structure for cleaning based on Internet of Things
  • Clamping structure for cleaning based on Internet of Things
  • Clamping structure for cleaning based on Internet of Things

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0022] see Figure 1 to Figure 5 , a clamping structure for cleaning based on the Internet of Things, including a main body 1, at least three claws slidingly connected to one end of the main body 1 for clamping a wafer 2, and a detection mechanism for detecting the roundness of the wafer 2 , a control mechanism for controlling the opening and closing of the claws, a processing module 29 connected to the detection mechanism, and a wireless communication module 6 connected to the processing module 29;

[0023] The end of the main body 1 is provided with several support columns 4 for supporting the wafer 2; the number of claws is four.

[0024] The claws are arranged in an annular array around the axis of the main body 1 .

[0025] The end of the main body 1 is provided with a chute 3 at the corresponding position of the claw, and a slider 5 is slidably connected in the chute 3, and the claw is connected to the corresponding slider 5, and the chute 3 is close to the main body 1 ...

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PUM

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Abstract

The invention discloses a clamping structure for cleaning based on the Internet of Things, and relates to the technical field of wafer cleaning. The clamping structure comprises a main body, at leastthree claw parts slidably connected to one end of the main body and used for clamping a wafer, a detection mechanism used for detecting the roundness of the wafer, a control mechanism used for controlling the claw parts to be opened and closed, a processing module connected with the detection mechanism, and a wireless communication module connected with the processing module; the end part of the main body is provided with a plurality of supporting columns used for supporting a wafer; the claw parts are arranged in an annular array by taking the shaft of the main body as the center. The invention provides a clamping structure for cleaning based on the Internet of Things. Remote monitoring can be conducted.

Description

technical field [0001] The invention belongs to the technical field of wafer cleaning, in particular to a clamping structure for cleaning based on the Internet of Things. Background technique [0002] After the wafer is produced, it needs to be cleaned. When cleaning, the wafer is clamped by the clamping structure, and then cleaned. [0003] Existing clamping structures cannot be remotely monitored. Contents of the invention [0004] The purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art, and propose a clamping structure for cleaning based on the Internet of Things, capable of remote monitoring. [0005] In order to achieve the above object, the present invention adopts the following technical solutions: [0006] A clamping structure for cleaning based on the Internet of Things, including a main body, at least three claws slidingly connected to one end of the main body for clamping wafers, a detection mechanism for detecting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/687H01L21/67B08B13/00B07C5/34B07C5/02B07C5/36
CPCB07C5/02B07C5/34B07C5/361B08B13/00H01L21/67259H01L21/6838H01L21/68714
Inventor 汪钢
Owner 宁波润华全芯微电子设备有限公司
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