Semiconductor integrated circuit and temperature drift compensation method for semiconductor integrated circuit

An integrated circuit and temperature drift compensation technology, applied in the field of temperature drift compensation, to achieve the effects of reducing production costs, improving production efficiency, and accurate temperature drift calibration

Active Publication Date: 2021-04-27
HANGZHOU SDIC MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Embodiments of the present disclosure provide a semiconductor integrated circuit and a temperature drift compensation method for a semiconductor integrated circuit, aiming to solve the above-mentioned problems and other potential problems existing in conventional bandgap reference temperature drift solutions

Method used

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  • Semiconductor integrated circuit and temperature drift compensation method for semiconductor integrated circuit
  • Semiconductor integrated circuit and temperature drift compensation method for semiconductor integrated circuit
  • Semiconductor integrated circuit and temperature drift compensation method for semiconductor integrated circuit

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Embodiment Construction

[0029] Preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0030] As used herein, the term "comprise" and its variants mean open inclusion, ie "including but not limited to". The term "or" means "and / or" unless otherwise stated. The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment." The term "another embodiment" means "at least one further embodiment". The terms "upper", "lower", "front", "rear" and o...

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PUM

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Abstract

Embodiments relate to a semiconductor integrated circuit and a temperature drift compensation method for the semiconductor integrated circuit. The semiconductor integrated circuit includes: a bandgap reference circuit configured to generate a reference voltage VREF; a temperature drift compensation circuit coupled to the bandgap reference circuit and configured to compensate for a temperature drift of the reference voltage VREF based on the digital control logic; a micro-current source circuit coupled to the bandgap reference circuit and configured to generate a micro-current IOUT1 based on a reference voltage VREF; and a current amplification and test circuit coupled to the micro-current source circuit and including an operational amplifier U3, a resistor R9, a resistor R10, a heating power triode Q4, and a switch K1, a switch K2 and a switch K3, the current amplification and test circuit being configured to generate a current IIN flowing through the heating power triode Q4 based on the micro-current IOUT1 when the switch K1, the switch K2 and the switch K3 are turned on, thus, the heating power triode Q4 is heated, and the temperature of the environment where the band-gap reference circuit is located is changed.

Description

technical field [0001] Embodiments of the present disclosure generally relate to the field of semiconductor integrated circuits, and more particularly, relate to a semiconductor integrated circuit and a temperature drift compensation method for the semiconductor integrated circuit. Background technique [0002] Reference voltage sources play a very important role in analog signal processing systems and mixed signal processing systems, and are used to provide voltage references for other circuits in the system. For example, reference voltage sources are widely used in many semiconductor integrated circuits such as analog-to-digital converters (ADC), digital-to-analog converters (DAC), sensors, etc., and their accuracy and stability will directly affect the signal processing accuracy of these circuits, such as ADC Or the conversion accuracy of DAC, etc., the sensing signal accuracy of sensors, etc. How to design an accurate and stable reference voltage source has always been ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05F1/567
CPCG05F1/567
Inventor 黄海龙陈建章赵双龙
Owner HANGZHOU SDIC MICROELECTRONICS
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