The invention relates to the field of
semiconductor circuit packaging detection, and discloses a via hole
welding spot
tin penetration depth detection device and method based on
infrared thermal imaging, and the device comprises an excitation source unit, a
control system, an
infrared imager, and a tested piece. A plurality of via hole
welding spots are distributed on the surface of the tested piece, the
infrared imager and the excitation source unit are located on the two sides of the tested piece respectively, and the excitation source unit is used for heating the surface of the tested piece; a camera of the infrared imager is aligned with a plurality of via hole
welding spots on the surface of the tested piece; the control end of the
control system is respectively connected with the control ends of the infrared imager and the excitation source unit, the excitation source unit can quickly heat the surface of the test piece to be tested, the infrared imager can capture and
record the temperature change in real time, and the captured image is fed back to the
control system; and the
tin penetration depth of the via hole welding spot is obtained through
processing of the control
system, so that the detection efficiency of the
tin penetration depth of the via hole welding spot is effectively improved.