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Photosensitive imaging assembly of camera

A technology for imaging components and cameras, which is applied to components of color TVs, components of TV systems, electrical components, etc., and can solve problems such as poor imaging quality of image sensors

Active Publication Date: 2021-05-18
HANGZHOU HIKVISION DIGITAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] As a result, the assembly stress during assembly will be more concentrated on the circuit board of the imaging module, resulting in poor imaging quality of the image sensor arranged on the circuit board (such as image virtual focus), especially when the lens assembly uses pixel precision When using a full-color fixed-focus lens with high height and large lens size

Method used

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  • Photosensitive imaging assembly of camera
  • Photosensitive imaging assembly of camera

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Embodiment Construction

[0092] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0093] figure 1 It is a schematic diagram of the assembly structure of the photosensitive imaging component of the camera in one embodiment. figure 2 For such figure 1 Schematic diagram of the exploded structure of the photosensitive imaging component shown. See figure 1 and combine figure 2 , in this embodiment, the photosensitive imaging component of the camera may include:

[0094] An imaging module 10, the imaging module 10 may have a circuit board 11 and an image sensor 12 arranged on the circuit board 11 (for example, the image sensor 12 may be located on the front surface of the circuit board 11 when placed vertically);

[0095] A lens module 20, the lens module 20 can have a mirror base 21 and a lens 22 installed on the mirror base 21, wh...

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Abstract

The invention discloses a light sensation imaging assembly of a camera. Based on the invention, the imaging module can only be directly and fixedly connected with the lens module, and can be indirectly arranged on the fixed frame through the mounting housing assembled with the lens module, so that the assembly stress borne by the circuit board of the imaging module can be reduced; therefore, the influence of deformation or vibration of the circuit board in response to the assembly stress on the image sensor of the imaging module is reduced, so that the influence of the assembly stress on the imaging quality of the imaging module is reduced.

Description

technical field [0001] The invention relates to camera assembly technology, in particular to a photosensitive imaging component of a camera. Background technique [0002] The photosensitive imaging component of the camera includes an imaging module and a lens module, and the imaging module and the lens module are installed inside the camera through a fixed frame. [0003] The imaging module usually includes a Sensor (sensor) board, that is, the Sensor (sensor) board is a circuit board with an image sensor. During assembly, the imaging module is arranged between the lens module and the fixed frame, and there is a rigid connection between the imaging module and the lens module and the fixed frame, for example, the circuit board of the imaging module is glued to the lens assembly, And it is fixedly connected with the fixed frame by screws. [0004] As a result, the assembly stress during assembly will be more concentrated on the circuit board of the imaging module, resulting ...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/52H04N23/55H04N23/51H04N23/54
Inventor 隋真真关宏杰徐忠文
Owner HANGZHOU HIKVISION DIGITAL TECH
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