Double-sided adhesive tape forming method and double-sided adhesive tape

A technology of double-sided tape and molding method, which is applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problems of high cost, falling off, double-sided tape displacement, etc., and achieve the improvement of yield rate and cost reduction Effect

Pending Publication Date: 2021-06-25
DONGGUAN SHENGXIANG PRECISION METAL
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

An existing double-sided adhesive tape is attached to the release film, and the release force of the release surface of the release film is small. When the double-sided adhesive tape is attached to the release film, the double-sided adhesive is processed to form the Due to the small release force of the release film, the double-sided adhesive is easy to detach from the release film. During the processing, the cutter cuts the double-sided adhesive, which will easily cause the double-sided adhesive to shift or fall off, making the final Double-sided tape has a high rate of defective products and high cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-sided adhesive tape forming method and double-sided adhesive tape
  • Double-sided adhesive tape forming method and double-sided adhesive tape
  • Double-sided adhesive tape forming method and double-sided adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.

[0043] In the description of the present application, it should be understood that the orientation descriptions, such as the orientation or positional relationship indicated by up, down, front, back, outside, and inside, etc., are based on the orientation or positional relationship shown in the drawings, and only In order to facilitate the description of the present application and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a double-sided tape forming method. The double-sided tape forming method comprises the following steps: compounding a first release film onto an adhesive surface of a protective film; compounding at least one layer of single-sided adhesive to two sides of the first release film, and forming a single-sided adhesive layer on the upper surface of the first release film; and compounding the double-sided adhesive onto the non-adhesive surface of the single-sided adhesive layer and the first release film to form the double-sided adhesive tape. The first release film is compounded to the adhesive surface of the protective film, the single-sided adhesive layer is attached to the first release film, after attachment, the double-sided adhesive is compounded to the single-sided adhesive layer and the first release film, and the double-sided adhesive is attached to the non-adhesive surface of the single-sided adhesive layer to form good attachment, so that in the whole processing process, the phenomena of chip falling or displacement and the like are avoided, the yield is improved, and the cost is effectively reduced.

Description

technical field [0001] The application belongs to the technical field of double-sided tape molding, and in particular relates to a double-sided tape molding method and double-sided tape. Background technique [0002] The double-sided tape has good waterproof and adhesive force, good temperature resistance, good thermal stability and chemical stability, and is suitable for a wide temperature range and is suitable for harsh environments. Therefore, double-sided tape is widely used in electronic products such as mobile phones, LCD TVs, and earphones. An existing double-sided adhesive tape is attached to the release film, and the release force of the release surface of the release film is small. When the double-sided adhesive tape is attached to the release film, the double-sided adhesive is processed to form the Due to the small release force of the release film, the double-sided adhesive is easy to detach from the release film. During the processing, the cutter cuts the doubl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/20C09J7/29
CPCC09J7/20C09J7/29C09J2433/00
Inventor 钟国志
Owner DONGGUAN SHENGXIANG PRECISION METAL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap