Ultra-thin PCB pressing process

Abstract

An ultra-thin PCB pressing process is used for forming an ultra-thin PCB, the ultra-thin PCB can be a single-layer board or a multi-layer board, and comprises the following steps: (1) selecting an original core board, wherein the original core board comprises an insulating layer and two copper-clad boards, a gluing area is arranged at the edge of the inner side of each copper-clad board, a glue layer is arranged on each gluing area, and in a vacuum environment, the two copper-clad boards are fixed to the two sides of the insulating layer, the gluing areas of the plate edges of the copper-clad boards are firmly bonded with the insulating layer through the glue layers, and the thickness of the insulating plate is at least larger than 0.5 mm; (2) laminating, namely stacking PP and copper layers on two sides of the original core plate to form a laminated plate group, and forming an ultrathin PCB by the copper-clad plate on the original core plate and the PP and copper layers on the same side; (3) drilling and electroplating; (4) stripping the core plate; and (5) forming an outer-layer circuit. The problems of deformation, abnormal plate expansion and contraction and the like caused by the thickness of the thin plate are effectively avoided.

Description

technical field [0001] The invention relates to a circuit board manufacturing process, in particular to an ultra-thin PCB board pressing process. Background technique [0002] The pressing process of printed circuit boards is to select the appropriate core board first, complete the circuit making of the inner core board, and then stack "copper foil, PP, inner core board, PP 3, copper foil" to utilize the product Layer method, one or more times of lamination to complete the lamination of multi-layer boards. Then carry out post-processing such as drilling and electroplating. With this process, the thickness of the board will also increase with the increase of layers. For the production and processing of ultra-thin PCB multilayer boards (board thickness <0.2mm), there are the following problems: [0003] 1. If ultra-thin materials are used for laminate lamination, since the core board and PP used are relatively thin during lamination, problems such as deformation and abnor...

AI Technical Summary

Problems solved by technology

[0003] 1. If ultra-thin materials are used for laminate lamination, since the core board and PP used are relatively thin during lamination, problems such as deformation and abnormal expansion and contraction are prone to occur; Too thin, inconvenient to operate, there will be a series of quality problems such as broken board, deformation, uneven copper plating, etc.

[0004] 2. If thicker materials are used for lamination, the thickness of the completed PCB board is too thick, and it is easy to exceed the required range

Images