Printed circuit board
A technology of printed circuit boards and substrates, which is applied in the direction of printed circuits, printed circuits, printed circuit manufacturing, etc., and can solve problems such as product reliability and heat dissipation characteristics reduction, delamination, and complex processes
Pending Publication Date: 2021-07-06
SAMSUNG ELECTRO MECHANICS CO LTD
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- Description
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- Application Information
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Problems solved by technology
However, in this case, there is a problem that the reliability and heat dissipation characteristics of the product may be degraded by the introduction of the insulating material
However, even in this case, the process may be complicated and the manufacturing cost may be increased, and defects such as cracks, delamination, etc. of via holes may occur
[0005] Therefore, it may be desirable to form a filled-type via in a penetrating portion penetrating a thick core substrate or a multilayer substrate, but voids may occur when plating is performed in a simple manner to fill the penetrating portion
Method used
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Embodiment Construction
[0019] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.
[0020] A printed circuit board
[0021] figure 1 is a schematic cross-sectional view of the first plating layer of the printed circuit board 100A according to the example.
[0022] figure 2 is a schematic cross-sectional view of a printed circuit board 100A according to an example.
[0023] Figure 3A to Figure 3B is a schematic cross-sectional photograph of a first plating layer and a second plating layer of a printed circuit board 100A according to an example.
[0024] refer to Figure 1 to Figure 3B , the printed circuit according to an example may include: a substrate 110 having a first surface 110-1 and a second surface 110-2 opposite to the first surface 110-1, and having - a penetrating portion H penetrating between 2; and a penetrating via hole V filling at least a part of the penetrating portion H.
[0025] The through via V m...
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The invention provides a printed circuit board which includes a substrate having a first surface and a second surface, opposite to the first surface, and having a through-portion penetrating between the first surface and the second surface; and a through-via disposed in at least a portion of the through-portion, wherein the through-via includes a first metal layer having a first groove portion facing an interior of the through-portion from the first surface of the substrate and a second groove portion facing the interior of the through-portion from the second surface of the substrate, and the first metal layer has a first region, and a second region, having different average grain sizes.
Description
[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0001424 filed in the Korean Intellectual Property Office on January 6, 2020, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a printed circuit board. Background technique [0003] In the case of using thick core substrates, or in the case of multi-layer substrates, conductive material may be formed along the walls of the via holes and vias filled with insulating material such as plated through holes (PTH) may be used. ). In this case, however, there is a problem that the reliability and heat dissipation characteristics of the product may be degraded by the introduction of the insulating material. [0004] Furthermore, in the case of multilayer substrates, stacked vias or staggered vias (in which multiple vias are connected in the vertical direction) may be considered. However, even in this ...
Claims
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IPC IPC(8): H05K1/11H05K1/02
CPCH05K1/0298H05K1/115H05K1/0206H05K1/0271H05K3/429H05K2201/0338H05K2201/0344H05K2201/09536H05K2201/09563H05K2203/072H05K2203/0723H05K2203/1476H05K2203/1492H05K3/4644
Inventor 崔锺赞郑荣权金旼修文盛载
Owner SAMSUNG ELECTRO MECHANICS CO LTD