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Electronic device and heat dissipation assembly thereof

一种散热组件、热引导的技术，应用在电路热装置、电气元件、印刷电路零部件等方向，能够解决丧失防水、降低等问题，达到降低短路故障的效果

Pending Publication Date: 2021-07-09
QUANTA COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, after parts repair / replacement or reassembly of heat dissipation facilities, it often results in reduced or lost waterproof function, which in turn increases the chance of internal components causing short circuit failures

Method used

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  • Electronic device and heat dissipation assembly thereof
  • Electronic device and heat dissipation assembly thereof
  • Electronic device and heat dissipation assembly thereof

Examples

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Embodiment Construction

[0080] Several embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is to say, in the embodiment of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some conventional structures and elements will be shown in a simple and schematic way in the drawings.

[0081] figure 1 A perspective view of an electronic device 10 according to an embodiment of the present invention is shown. figure 2 draw figure 1 exploded view. Figure 3A draw figure 1 A cross-sectional view of the electronic device 10 along the line segment AA. Such as Figure 1 to Figure 3A As shown, the electronic device 10 includes a heat dissipation component 100 and a heat source 500 . The h...

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PUM

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Abstract

An electronic device and a heat dissipation assembly are disclosed. The heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two slots. The cover body covers the bottom plate to define an accommodation space therebetween, and the slots are oppositely formed on the cover body and connected to the accommodation space. The heat guiding base thermally contacts the heat-generating source and the cover body, and is formed with voids arranged alongside, each of the voids is communication with the slots respectively. The side cover sets are disposed within the slots, respectively, and detachably connected to the cover body and the heat guiding base. The flow-acceleration unit is disposed in one of the side cover sets to lead a fluid to the other through the voids.

Description

technical field [0001] The invention relates to a heat dissipation assembly, in particular to a heat dissipation assembly with a tunnel-type heat guiding module. Background technique [0002] Many internal components of a computer generate a lot of heat during operation, so good cooling facilities are a key factor in determining the performance and reliability of a computer. For example, the heat dissipation problem of the central processing unit (CPU) and / or graphics processing unit (GPU) with the highest workload is the most difficult. In addition, great attention is paid to waterproof measures for the heat dissipation facilities of the above-mentioned internal components, so as to reduce the chance of short-circuit faults caused by the influence of moisture on the internal components. [0003] However, after parts repair / replacement or reassembly of heat dissipation facilities, it often results in reduced or lost waterproof function, which in turn increases the chances o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20172H05K7/20145H05K7/20163H05K7/20263H05K7/2039H05K1/0203
Inventor 林庆达曹吕龙洪政彰蔡玉晴
Owner QUANTA COMPUTER INC
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