Chip package structure and method for forming the same

Abstract

A chip package structure and a method for forming the chip package structure are provided. The method includes disposing a first chip structure and a second chip structure over a wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The method includes disposing a ring structure over the wiring substrate. The ring structure has a first opening, the first chip structure and the second chip structure are in the first opening, the first opening has a first inner wall, the first inner wall has a first recess, and the gap extends toward the first recess.

Description

technical field [0001] Embodiments of the present disclosure relate to a chip packaging structure and a forming method thereof, in particular to a chip packaging structure having a ring structure and a forming method thereof. Background technique [0002] Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment. Semiconductor devices are usually manufactured by sequentially depositing insulating or dielectric layers, wiring layers, and semiconductor layers on a semiconductor substrate, and patterning various material layers using lithography and etching processes to form circuit components and components on top of it. [0003] Typically, many integrated circuits (ICs) are fabricated on semiconductor wafers, and technological advances in integrated circuit materials and design have produced generations of integrated circuits. Each generation of circuits is smaller and mor...

AI Technical Summary

Problems solved by technology

Forming reliable chip-package structures with multiple chips remains challenging since chip-package structures may need to contain multiple chips with multiple functions

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