Packaging device and packaging method thereof
A packaging device and guide rail technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of unstable pressure, low control accuracy, low curing accuracy, etc., to meet production and manufacturing needs, ensure curing accuracy, The effect of improving curing accuracy
Active Publication Date: 2021-09-28
中科长光精拓智能装备(苏州)有限公司
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Problems solved by technology
[0003] Existing chip thermocompression curing devices generally adopt the two-way heating and one-way pressure mode of the upper and lower thermocompression heads, and use the cylinder to control the pressure, which seriously affects the accuracy of pressure application, so that the gap between the chips packaged by each thermocompression head and the antenna is not equal. , the parallelism of hot pressing cannot be guaranteed, the curing accuracy is not high, and the quality of the electronic label is easily reduced
On the other hand, for the control of hot-press curing pressure, the traditional method is only to control the pressure through a pressure regulating valve or an electric proportional valve, without pressure feedback and pressure closed-loop control, resulting in unstable pressure during chip hot-press curing, low control accuracy, and affecting binding force to the chip, resulting in unreliable product performance
Method used
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[0027] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0028] In one aspect, the present invention provides a packaging device.
[0029] figure 1 It shows a schematic diagram of the first structure of the packaging device of the present invention, figure 2 It shows a schematic diagram of the second structure of the packaging device of the present invention. The packaging device includes an upper hot-press unit 1, a lower hot-press unit 2, and a base 3. The upper hot-press unit 1 and the lower hot-press unit 2 can be heated separately and the temperature can be controlled as Prior art, the present invention is not limited thereto. In the embodiment, a group of two guide rails 4 are fixed on a base 3 parallel to each other, and the number of guide ...
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The invention relates to the technical field of chip packaging, and provides a packaging device and a packaging method thereof. The packaging device comprises: an upper hot pressing unit, a lower hot pressing unit, and a base, and a chip hot pressing is formed between the upper hot pressing unit and the lower hot pressing unit. In the curing area, the packaging device further includes at least one guide rail fixedly arranged on the base, and guide rail sliders matching the number of the guide rails. Corresponding guide rail sliders are fixedly connected and slide up and down along the guide rail. Through the packaging device and the packaging method provided by the present invention, the parallelism of hot pressing can be ensured in the chip production process, the curing accuracy can be improved, and the production and manufacturing requirements of multi-type chips can be met.
Description
technical field [0001] The present invention relates to the technical field of chip packaging, and more particularly to a packaging device and a packaging method thereof. Background technique [0002] With the increasing application of electronic tag chips, not only can they replace commodity barcodes in the retail industry, but also can be widely used in many industries such as logistics tracking and transportation. Electronic label chips are widely used, and higher requirements are put forward for electronic label chip packaging equipment. How to reduce the cost of manufacturing electronic tag chips while ensuring the quality of electronic tags has become the most concerned issue in the industry. An important link that affects the cost is the packaging cost of the electronic label chip. The hot-press curing of the chip is one of the main processes of the electronic label packaging. As the chip becomes smaller and smaller, the packaging speed is getting faster and faster. ...
Claims
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IPC IPC(8): H01L21/67H01L21/50H01L21/56
CPCH01L21/50H01L21/56H01L21/67092H01L21/67121
Inventor 张德龙孙斌周亚棚张喜华
Owner 中科长光精拓智能装备(苏州)有限公司