A printed circuit board with an embedded array of microfluidic channels and its preparation method

Abstract

The invention discloses a printed circuit board embedded with an array of micro-flow channels and a preparation method thereof. The circuit board includes a metal core board (1), and the upper surface of the metal core board (1) is provided with a top multi-layer wiring layer ( 6), the bottom surface is provided with a bottom multi-layer wiring layer (9), the metal core board (1) is embedded with an array of heat dissipation micro-channels (2), and the array of heat-dissipation micro-channels (2) is connected to the liquid inlet and outlet (5 ). The invention integrates the metal core board embedded with the micro-flow channel into the printed circuit board, realizes heat dissipation with high heat flux density, and satisfies the requirements of high-efficiency heat dissipation and high-density integration of low-profile arrays.

Description

A printed circuit board with embedded array microfluidic channel and preparation method thereof technical field The invention belongs to the technical field of heat dissipation of microelectronics, and in particular relates to a printed circuit board and Preparation. Background technique [0002] With the further improvement of the requirements of the electronic system to low cost, miniaturization, multi-function, etc., the radio frequency aperture is facing the Development in the direction of high-degree, low-profile integration. The existing traditional array integration method based on brick transceiver components has gradually become impossible. To meet the demanding requirements of electronic systems, it is urgent to develop a new generation of low-profile array integration technology based on tiled transceiver components. technology research, the arrayed RF transceiver channels are integrated on a complete printed circuit board, which further reduces the system ...

AI Technical Summary

Problems solved by technology

[0005] However, for the array integrated system, how to rationally arrange the arrayed high-efficiency array heat dissipation microchannels and shunt networks to achieve high heat and flow sharing; how to combine the array microchannel heat dissipation technology with the high-density integration technology of printed circuit boards In combination, while realizing arrayed high heat flux heat dissipation, it also meets the high-density integration requirements of low-profile arrays, and there are few reports so far.

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