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Pressure-sensitive component, pressure-sensitive component manufacturing method and overvoltage protection circuit

A technology for overvoltage protection circuits and pressure sensitive components, which is applied in overvoltage protection resistors, emergency protection circuit devices, varistors, etc.

Active Publication Date: 2021-09-07
捷捷半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of this application is to provide a pressure-sensitive component, a method for making the pressure-sensitive component and an overvoltage protection circuit, so as to solve the problems in the prior art that the varistor occupies a large volume and does not match the consistency of parameters

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  • Pressure-sensitive component, pressure-sensitive component manufacturing method and overvoltage protection circuit
  • Pressure-sensitive component, pressure-sensitive component manufacturing method and overvoltage protection circuit
  • Pressure-sensitive component, pressure-sensitive component manufacturing method and overvoltage protection circuit

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Embodiment Construction

[0046] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0047] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...

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Abstract

The invention provides a pressure-sensitive component, a pressure-sensitive component manufacturing method and an overvoltage protection circuit, and relates to the field of plastic packaging. The pressure-sensitive component comprises at least three pressure-sensitive resistor chips; four electrode plates, wherein the at least three piezoresistor chips and the four electrode plates are arranged in a layered manner, at least one piezoresistor chip is arranged between every two adjacent electrode plates, each electrode plate is electrically connected with the adjacent piezoresistor chip, and each electrode plate comprises a pin; and a plastic package body, wherein the at least three piezoresistor chips and the four electrode plates are packaged in the plastic package body, and the pin of each electrode plate is exposed out of the plastic package body. The voltage-sensitive component, the voltage-sensitive component manufacturing method and the overvoltage protection circuit provided by the invention have the advantages of smaller size, lower cost and better consistency between devices.

Description

technical field [0001] The present application relates to the field of plastic packaging, in particular, to a pressure-sensitive component, a method for making the pressure-sensitive component, and an overvoltage protection circuit. Background technique [0002] Varistors are widely used in many fields such as electric power, communication, computer, automobile, industrial control, and electronics. [0003] In the overvoltage protection scheme of the three-phase power supply, the existing usage is that three in-line varistors or mount varistors are arranged at the power inlet end; and for the varistor differential mode and common Die protection scheme, the current usage is 3 plug-in or chip varistors plus 3 bidirectional TVS devices or placed in the front end of the protected circuit. [0004] With the requirements of higher integration, smaller size and lower cost of equipment, the space left by printed circuit boards for components is getting smaller and smaller. The pro...

Claims

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Application Information

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IPC IPC(8): H01C13/02H01C7/12H01C1/14H01C17/02H02H7/20
CPCH01C7/001H01C7/12H01C1/14H01C17/02H02H7/20
Inventor 王成森吴家健李成军
Owner 捷捷半导体有限公司
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