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Chip burning test equipment

A technology of testing equipment and chips, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve problems such as time-consuming, difficult, and easy to change

Pending Publication Date: 2021-09-10
深圳市海创嘉科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there is equipment in the existing technology that can test or burn multiple chips at the same time, in the existing equipment, it is necessary to put each chip on the carrier, then flip it over, and then make the connection of each chip The feet are in contact with the probes, so it takes a long time, and at the same time, the position of the chip is relatively easy to change during the flipping process of the chip, causing difficulties for the next step

Method used

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  • Chip burning test equipment
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Embodiment Construction

[0048] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0049] In order to better understand the above technical solutions, the following will describe exemplary embodiments of the present invention in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be more clearly and thoroughly understood, and the scope of the present invention can be fully conveyed to those skilled in the art.

[0050] see figure 1 , the present embodiment provides a chip burning test device for burning or testing a plurality of chips, the plurali...

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PUM

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Abstract

The invention relates to chip burning test equipment, which is used for burning or testing a plurality of chips, and the plurality of chips are respectively placed in a plurality of grooves in a tray; the chip burning test equipment comprises a seat body, a plurality of pins, a plurality of test terminals and a plurality of test terminals, the rail mechanism is arranged on the seat body, comprises two parallel rails and is used for clamping the tray between the parallel rails; a plurality of through holes are formed in the bottom of the groove in the tray; the probe plate is tightly attached to the tray, and the probe plate comprises a plurality of probes; the probes on the probe plate are in one-to-one correspondence with the through holes in the bottom of the groove in the tray; an upper probe of the probe plate penetrates through a through hole in the bottom of the groove in the tray, penetrates out of the bottom of the groove of the tray and is in contact with a pin on a chip at the bottom of the groove of the tray; the host device is arranged on the seat body and is electrically connected with the probe plate; and the host device is used for carrying out testing or data burning on a plurality of chips when pins of the chips are in contact with the probes.

Description

technical field [0001] The invention relates to the technical field of chip testing and chip programming, in particular to a chip programming testing device. Background technique [0002] Currently, during chip programming or testing, chip programming or testing can only be performed on one chip at a time. Although there is equipment in the existing technology that can test or burn multiple chips at the same time, in the existing equipment, it is necessary to put each chip on the carrier, then flip it over, and then make the connection of each chip The pins are in contact with the probes, so it takes a long time, and at the same time, the position of the chip is relatively easy to change during the flipping process of the chip, which causes difficulties for the next step. Contents of the invention [0003] (1) Technical problems to be solved [0004] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a chip progr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G06F8/61
CPCG01R31/2886G06F8/63
Inventor 涂海涛薛国荣冼祖国梁峰国蒋三海
Owner 深圳市海创嘉科技有限公司