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Feed-through device

A technology of wires and holes, applied in the field of feedthrough devices, can solve problems such as gaps, and achieve the effect of simplifying the difficulty of processing and manufacturing

Pending Publication Date: 2021-11-26
ADVANCED ION BEAM TECHNOLOGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, even if the heterogeneous solder 130 can completely seal the gap, and even if the collar 150 can completely surround the wires located outside the heterogeneous solder 130, the existing manufacturing process will inevitably cause problems in the interposer 110, heterogeneous Gap between weld 130 and collar 150

Method used

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Examples

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Embodiment Construction

[0042] Some embodiments of the invention relate to a feedthrough device. Such as Figure 2A As shown, the feedthrough device 200 includes at least one interposer 201 and one or more wire holes 203 , and the elastic pads 202 are placed one-to-one (like stuffed) into the wire holes 203 . In addition, if Figure 2BAs shown, the outline of each elastic pad 202 generally has a hollow space 2025 that allows the wire 204 to pass through, and has a shape that is narrow at one end and wide at the other end, wherein the narrower end is not wider than the corresponding wire hole 203 The width but the wider end is wider than the width of the corresponding hole 203 . In this way, when the elastic mat 202 is placed in the wire hole 203, the wire 204 can still pass through from one end of the interposer 201 to the other side through the hollow space 2025, or the part of the narrower end can be used to fill the gap located in the intermediary. The wire hole 203 inside the board 201 can als...

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Abstract

A feed-through device includes an interposer having at least one wire hole in which at least one wire can pass through from one side of the interposer to the other side of the interposer. Elastic pads made of an insulating material are arranged in the at least one wire hole respectively, each elastic pad isolates the interposer from the at least one wire passing through the wire corresponding hole; each wire comprises a conductor wire for transmitting current and an insulating material layer surrounding and wrapping the conductor wire. In each wire hole, the insulating material layer of one or more wires in the wire hole or the elastic pad in the wire hole can deform under pressure, so that no gap through which gas can pass exists between the conductor wire and the interposer.

Description

technical field [0001] The present invention relates to a feed-through device, and more particularly to a feed-through device suitable for preventing the discharge phenomenon of a wire passing therethrough when the vacuum levels on opposite sides thereof are different. Background technique [0002] Feedthrough devices (Feedthrough Apparatus) have been widely used in the semiconductor industry, micro-electromechanical industry, panel industry and memory industry, etc., for example, between two environments with different vacuum levels, or between two vacuum levels. Between disparate pieces of hardware, or even between two pieces of hardware that move relative to each other (relative movement and / or relative rotation are fine), feedthrough devices can be used as an interface between the two, and allow the conduction of current, Conductors of electrical energy and / or electrical signals may go from one to the other via a feedthrough. For example, U.S. Patent No. 6156978 disclos...

Claims

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Application Information

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IPC IPC(8): H01B5/00
CPCH01B5/002
Inventor 倪玉河胡瑞沧王德民簡鉦茂
Owner ADVANCED ION BEAM TECHNOLOGY INC