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Heat dissipation device and board card

A technology of heat sink and heat sink set, which is applied in the direction of modification by conduction heat transfer, cooling/ventilation/heating transformation, electrical components, etc. Advanced problems, to avoid unreliable welding, avoid uneven heat transfer, improve firm performance and heat dissipation efficiency

Pending Publication Date: 2021-12-03
CAMBRICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, limited by the sealing process of the heat pipe, there are differences in solderability and heat transfer performance at both ends of the heat pipe, resulting in problems such as unreliable welding between the sealed end of the heat pipe and the heat sink, and low heat dissipation efficiency.

Method used

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  • Heat dissipation device and board card
  • Heat dissipation device and board card
  • Heat dissipation device and board card

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Embodiment Construction

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present disclosure.

[0014] It should also be understood that the terminology used in this disclosure description is for the purpose of describing specific embodiments only, and is not intended to limit the present disclosure. As used in this disclosure and the claims, the singular forms "a", "an" and "the" are intended to include plural referents unless the context clearly dictates otherwise. It should also be further understood that the term "and / or" used in the present disclosure and the claim...

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PUM

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Abstract

The invention discloses a heat dissipation device and a board card, and the heat dissipation device can comprise a heat pipe group (110) which comprises a plurality of heat pipes (111, 112) used for absorbing heat, and at least one cooling fin group (120) which is in fixed contact with the heat pipe group (110) so as to cooperate with the heat pipe group (110) for heat dissipation. According to the heat dissipation assembly disclosed by the invention, the firmness performance and the heat dissipation efficiency of the heat dissipation device can be effectively improved.

Description

technical field [0001] The present disclosure generally relates to the field of heat dissipation technology. More specifically, the present disclosure relates to a heat dissipation device and a board. Background technique [0002] With the continuous optimization of the performance of electronic products and the continuous improvement of the power of various processors, higher requirements are placed on the performance and heat dissipation effect of radiators. In current heat sinks, heat pipes and heat sinks are widely used because of their good heat dissipation performance. However, limited by the sealing process of the heat pipe, there are differences in solderability and heat transfer performance at both ends of the heat pipe, resulting in problems such as unreliable welding and low heat dissipation efficiency at the connection position between the sealed end of the heat pipe and the heat sink. Therefore, how to solve the firm problem of the radiator and improve the hea...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20336
Inventor 不公告发明人
Owner CAMBRICON TECH CO LTD