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A method for detecting conductive adhesive printing of mwt photovoltaic modules

A photovoltaic module and conductive adhesive technology, which is applied in photovoltaic power generation, circuits, electrical components, etc., can solve problems such as the inability to accurately monitor the relative position of the conductive adhesive and the insulating layer, the inability to accurately monitor the printing status of conductive adhesive dots, and the inability to accurately check, etc.

Active Publication Date: 2022-02-18
JIANGSU SUNPORT POWER CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the production methods of back-contact photovoltaic modules are mainly: integrating conductive core board, conductive adhesive, insulating layer, cells, EVA, and glass lamination for vacuum packaging. In the existing process, it is impossible to accurately monitor all conductive adhesives. The printing status of the dots; the relative position of the conductive adhesive and the insulating layer cannot be accurately monitored; it is impossible to accurately check whether all glue dots lack conductive adhesive due to mesh blockage

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  • A method for detecting conductive adhesive printing of mwt photovoltaic modules

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Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the implementation of the present invention in detail in conjunction with the accompanying drawings.

[0027] Such as figure 1 As shown, the present invention discloses a method for detecting conductive adhesive printing of MWT photovoltaic modules, which specifically includes the following steps:

[0028] Step 1. Set the state of the transmission carrier board to make it in a normal working state.

[0029] Step 2, laying an integrated conductive backplane on the set carrier.

[0030] Step 3: Print the conductive glue on the integrated conductive backplane. The conductive glue should avoid missing when printing, and it should not be covered by the insulating layer. The conductive glue is printed as circular dot glue, and the size of the circular surface is ≥1.5mm.

[0031] Step 4, laying an insulating layer on the integrated conductive ...

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Abstract

The invention discloses a method for detecting the conductive adhesive printing of MWT photovoltaic modules. Optical cameras are used to screen out defects such as the appearance defects of the conductive adhesive and the relative position of the conductive adhesive and the insulating layer. The visual inspection method solves the problem that the inside of the module cannot pass manual inspection. The method detects defective problems, reduces the probability of degradation or scrapping of photovoltaic modules, and improves production efficiency.

Description

technical field [0001] The present application relates to the technical field of solar photovoltaic modules, in particular to a method for detecting conductive adhesive printing of MWT photovoltaic modules. Background technique [0002] MWT back-contact photovoltaic modules, because there is no main grid line on the front, and the positive and negative electrodes are on the back of the cell, which reduces the front shading loss and improves the power of the module; the use of conductive foil instead of welding ribbon reduces the series resistance and the working temperature of the module. Low-temperature conductive adhesive welding is used to avoid stress, poor welding and micro cracks caused by high-temperature welding, and improve the stability and reliability of components; it is suitable for ultra-thin silicon wafers and is compatible with the high efficiency of different processes such as MWT and IBC. Battery sheet, and then has a broad application prospect. [0003] A...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L31/18H01L31/048
CPCH01L22/12H01L22/20H01L31/18H01L31/048Y02E10/50Y02P70/50
Inventor 陈晓辉张允良顾群吴仕梁张凤鸣
Owner JIANGSU SUNPORT POWER CORP LTD