Wafer automatic bearing system and method for conveying wafer by adopting wafer automatic bearing system

Abstract

The invention discloses an automatic wafer bearing system and a method for conveying wafers by adopting the wafer automatic bearing system. The system comprises a vacuum chamber which is provided with a plurality of wafer bearing stations; multiple first paddles and multiple second paddles which are located in the vacuum chamber and can synchronously rotate respectively, wherein each second paddle and the corresponding first paddle form a pair of paddles so as to jointly bear a wafer; double sets of magnetic fluids which are in sealed connection with the vacuum chamber and are connected to the plurality of first paddles and the plurality of second paddles so as to drive one or both of the first paddles and the second paddles to rotate; a first driving mechanism which is connected to the double sets of magnetic fluid so as to drive the multiple first paddles and the multiple second paddles to synchronously rotate in the same direction through the double sets of magnetic fluid; and a second driving mechanism which is also connected to the double sets of magnetic fluid so as to realize relative rotation between the plurality of first paddles and the plurality of second paddles through the double sets of magnetic fluid. The system can reduce the movement steps of the wafer in the conveying process, so that the conveying precision and stability of the wafer are improved, and the position error of the wafer is reduced.

Description

technical field [0001] The invention relates to the field of semiconductor wafer processing, in particular to a system and method for carrying and transferring wafers in a semiconductor processing chamber. Background technique [0002] Wafers are the substrates used to fabricate semiconductor devices. In order to prepare semiconductor devices (such as integrated circuits, semiconductor light-emitting devices, etc.), it is necessary to place the wafer in a semiconductor processing chamber for heating and deposition processing (such as chemical vapor deposition (CVD) and plasma enhanced chemical vapor deposition (PECVD), etc.) . In this process, multiple wafers need to be sequentially placed on different stations (heating plates). Therefore, a special wafer carrying device is needed to place the wafers one by one on the heating plate and transfer them to different work stations. [0003] In the prior art, wafer carrying devices for carrying and transferring wafers generally...

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Problems solved by technology

[0003] In the prior art, wafer carrying devices for carrying and transferring wafers generally have some disadvantages. For example, some carrying devices cause the wafer to experience more movement processes during the transfer process, so the position error of the wafer is relatively large. Large, and even an alarm occurs during the transfer process; another example, the final position of the wafer on the heating plate cannot be accurately determined, resulting in poor quality of wafer film deposition; in addition, it may also lead to unreliable repeatability of wafer deposition copy

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