Removable thermal visbreaking adhesive tape and preparation method thereof
An adhesive tape and removal technology, which is applied in the direction of film/sheet adhesive, adhesive, adhesive type, etc., can solve the problems of laborious tape removal, affecting use, and easy to leave residual glue, etc., to achieve Ease of removal, improved peeling efficiency, and improved heat dissipation
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2021-12-28
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

Figure 1
Abstract
Description
technical field
[0001] The invention belongs to the technical field of special adhesive tapes, and in particular relates to a removable heat-adhesive adhesive tape and a preparation method thereof. Background technique
[0002] The development of adhesive tape is very rapid. It can be said that adhesive tape is used in all aspects of life. So far, there are many types, and each type has its specific use.
[0003] It uses paper, cloth, and film as base materials, and then evenly coats glue on the above base materials to make paper adhesive tapes, cloth adhesive tapes or film adhesive tapes. Then according to the adhesiveness, it can be divided into solvent adhesive tape, emulsion adhesive tape, calender adhesive tape and reactive adhesive tape. The adhesive tape is mainly composed of base material, adhesive, release paper (film ) consists of three parts.
[0004] At present, most of the adhesive tapes are strong, and it is laborious to remove the tape and it is easy to leav...
Examples
Embodiment 1
[0030] Such as figure 1 As shown, a removable heat-adhesive adhesive tape according to the present invention includes a substrate layer 1, a vulcanized layer 2, an adhesive layer 3, a first release film 4, and a heat-conducting layer arranged in sequence from top to bottom. 5. The thermal detackification layer 6 and the second release film 7; the vulcanization layer 2 is coated on the lower surface of the substrate layer 1, and the adhesive layer 3 is coated on the upper surface of the first release film 4, And the substrate layer 1 is bonded with the first release film 4 through the adhesive layer 3, and the heat conduction layer 5 is coated on the lower surface of the first release film 4, and the first release film 4 is connected with the second release film. The molded films 7 are connected by a thermal detackification layer 6 .
[0031] Wherein, the thickness of the thermal detackification layer 6 is 30 microns to 50 microns; the substrate layer 1 is a structure made of ...
Embodiment 2
[0034] This embodiment discloses a preparation method of a removable heat-adhesive adhesive tape on the basis of embodiment 1, comprising the following steps:
[0035] Step 1. Preparation of acrylate copolymer: Weigh 20% of isooctyl acrylate, 60% of butyl acrylate, 10% of methyl methacrylate, and 10% of glycidyl methacrylate according to the mass ratio, and pass through the initiator Polymerization reaction obtains acrylate copolymer;
[0036] Step 2. Pretreatment of white carbon black: Weigh a certain amount of white carbon black, dry it in a drying oven at 70-80°C for 4-6 hours, take it out, and grind it into a uniform particle size of 30-50 microns with a grinder. particles;
[0037] Step 3. Preparation of thermal viscose-reducing adhesive: Weigh 100 parts of acrylate copolymer, 1 part of crosslinking curing agent, 5 parts of foaming agent, 0.2 part of white carbon black, 20 parts of organic solvent and 1 part of color paste according to parts by weight. part, stir and mi...
Embodiment 3
[0041] The preparation method of the removable thermal adhesive tape disclosed in this example is basically the same as Example 2, the only difference is that the raw material ratio of acrylate copolymer is: isooctyl acrylate 30%, butyl acrylate 30%, methyl methacrylate 20%, glycidyl methacrylate 20%.