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A kind of copper alloy composite material and its preparation method and application

A technology of composite materials and copper alloys, applied in the direction of conductive materials, conductive materials, metal processing equipment, etc., can solve the problems of weak interface bonding, burning and agglomeration, cracks and porous graphene, etc., to improve the bonding force, The effect of increasing the number of grains and reducing the surface energy

Active Publication Date: 2022-05-24
HOHAI UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method solves the technical problems of weak interfacial bonding, cracks and pores, and graphene burning and agglomeration after the composite of graphene and copper

Method used

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  • A kind of copper alloy composite material and its preparation method and application
  • A kind of copper alloy composite material and its preparation method and application
  • A kind of copper alloy composite material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A copper alloy composite material, comprising the following components: 0.55wt% of graphene, 0.5wt% of a dispersant and the balance of copper powder; the high-strength and high-conductivity graphene / copper composite material is copper-CuC 2 - Graphene multilayer composite structure. The particle size of the copper powder is 200 meshes and the purity is 99.99%.

[0045] The dispersant is modified polyvinyl alcohol, and the preparation method of the modified polyvinyl alcohol is:

[0046] S01. Weigh hexanonyltrimethylamine hydroxide and polyvinyl alcohol at a mass ratio of 1:1.5, add deionized water at a solid-to-liquid ratio of 1:3, and make a mixed solution of 280mL at 45°C with magnetic stirring for 30min;

[0047]S02. Continue to add 30 mL of potassium hexametaphosphate solution with a mass fraction of 7.7% to the mixed solution, and ultrasonically disperse for 1 h;

[0048] S03. After the dispersed mixed solution is allowed to stand for precipitation, carry out suc...

Embodiment 2

[0054] A copper alloy composite material, comprising the following components: 0.6wt% of graphene, 0.8wt% of a dispersant and the balance of copper powder; the high-strength and high-conductivity graphene / copper composite material is copper-CuC 2 - Graphene multilayer composite structure. The particle size of the copper powder is 400 mesh and the purity is 99.99%.

[0055] The dispersant is modified polyvinyl alcohol, and the preparation method of the modified polyvinyl alcohol is:

[0056] S01. Weigh hexanonyltrimethylamine hydroxide and polyvinyl alcohol at a mass ratio of 1:1.5, add deionized water at a solid-to-liquid ratio of 1:3, and make a mixed solution of 590mL at 65°C with magnetic stirring for 45min;

[0057] S02. Continue to add 60 mL of potassium hexametaphosphate solution with a mass fraction of 7.7% to the mixed solution, and ultrasonically disperse for 2h;

[0058] S03. After the dispersed mixed solution is allowed to stand for precipitation, carry out suctio...

Embodiment 3

[0064] A copper alloy composite material, comprising the following components: 0.82wt% of graphene, 1wt% of a dispersant and the balance of copper powder; the high-strength and high-conductivity graphene / copper composite material is copper-CuC 2 - Graphene multilayer composite structure. The particle size of the copper powder is 300 mesh and the purity is 99.99%.

[0065] The dispersant is modified polyvinyl alcohol, and the preparation method of the modified polyvinyl alcohol is:

[0066] S01. Weigh hexanonyltrimethylamine hydroxide and polyvinyl alcohol at a mass ratio of 1:1.5, add deionized water at a solid-to-liquid ratio of 1:3, and make a mixed solution of 860mL at 55°C with magnetic stirring for 40min;

[0067] S02. Continue to add 45 mL of potassium hexametaphosphate solution with a mass fraction of 7.7% to the mixed solution, and ultrasonically disperse for 1.5 h;

[0068] S03. After the dispersed mixed solution is allowed to stand for precipitation, carry out suct...

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Abstract

The invention discloses a copper alloy composite material, which comprises the following components: 0.55-0.82wt% graphene, 0.5-1wt% dispersant and copper powder in the balance; the high-strength and high-conductivity graphene / copper composite material is copper -CuC 2 ‑Graphene multilayer composite structure. The invention also discloses a preparation method of the copper alloy composite material and its application in electronic information and aerospace cables. In the present invention, graphene, dispersant and copper powder are mixed in solid phase; the mixed material is ball-milled, and the ball-milled powder is annealed; the annealed powder is pressed into shape, and pressurized and sintered; The prepared sample is subjected to hot extrusion treatment to achieve the purpose of refining grains, eliminating defects, improving mechanical properties and electrical conductivity; the invention can realize good dispersion of graphene in composite materials, and significantly improve the tensile strength At the same time, it can also take into account the conductivity.

Description

technical field [0001] The invention relates to a copper alloy composite material, a preparation method and application thereof, and belongs to the technical field of composite materials. Background technique [0002] As one of the earliest metals used by mankind, copper and its alloys are widely used in power transmission, automobile manufacturing, aerospace and other fields due to their excellent electrical and thermal conductivity. However, copper itself has poor mechanical properties, low strength, easy oxidative deformation under high temperature, and is prone to breakage during use, which limits its application to a certain extent. Composite materials are necessary. Graphene is a sp 2 The new material in which the carbon atoms of hybrid connection are tightly packed into a single-layer two-dimensional honeycomb structure is one of the materials with the highest known strength. The intrinsic tensile strength is 130GPa; the thermal conductivity is as high as 5300W / mK, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/05B22F9/04B22F1/142B22F1/10B22F3/14B22F3/04H01B1/02B21C23/00
CPCC22C9/00C22C1/05B22F9/04B22F3/14B22F3/04H01B1/026B21C23/001B22F2009/043B22F2009/042
Inventor 刘欢包晨伟巨佳吴玉娜禚孝儒李旋房梦飞胡亮
Owner HOHAI UNIV