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Wafer processing method

A processing method and wafer technology, which can be used in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., and can solve the problems of device chip quality degradation and other issues

Pending Publication Date: 2022-03-01
DISCO CORP
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  • Abstract
  • Description
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Problems solved by technology

[0012] However, since the protective sheet adheres strongly to the wafer, a part of the protective sheet may remain slightly on the front side of the wafer after the protective sheet is peeled off from the wafer.
In addition, when the wafer is processed without noticing that the residue of the protective sheet remains on the wafer, the quality of the device chip will be lowered similarly to the case of using the protective tape.

Method used

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Embodiment Construction

[0029] Hereinafter, an embodiment of one aspect of the present invention will be described with reference to the drawings. First, a configuration example of a wafer processed by the wafer processing method of this embodiment will be described. figure 1 is a perspective view showing the wafer 11 .

[0030] The wafer 11 is, for example, a disk-shaped substrate formed of a semiconductor such as silicon, and has a front surface (first surface) 11a and a rear surface (second surface) 11b substantially parallel to each other. The wafer 11 is divided into a plurality of rectangular regions by a plurality of dividing lines (streets) 13 arranged in a grid pattern so as to intersect each other. In addition, IC (Integrated Circuit, integrated circuit), LSI (Large Scale Integration, large-scale integration), LED (Light Emitting Diode, light emitting diode), MEMS (Micro Electro Mechanical Systems, Micro Electro Mechanical Systems) and other devices 15 .

[0031] In addition, the materia...

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Abstract

The invention provides a wafer processing method which can confirm whether residues of a protection part exist on a wafer or not. A wafer processing method for processing a back side of a wafer having recesses and projections on a front side, the wafer processing method comprising: a protective member arrangement step of bringing a protective member into close contact with the front side of the wafer along the recesses and projections and covering the front side of the wafer with the protective member; a processing step of processing the back side of the wafer by holding the protective member side of the wafer by using the chuck table after the protective member arrangement step is performed; a protective member peeling step of peeling the protective member from the front surface side of the wafer after the processing step is performed; and a residue determination step of determining whether or not there is a residue of the protective member on the front side of the wafer after the protective member peeling step is performed, and recording a determination result for each wafer.

Description

technical field [0001] The present invention relates to a wafer processing method in which a wafer is covered with a protective member and processed. Background technique [0002] In the manufacturing process of a device chip, a wafer is used in which devices are respectively formed in a plurality of regions divided by a plurality of dividing lines (lanes) arranged in a grid pattern. The wafer is divided along planned dividing lines to obtain a plurality of device chips each having a device. Device chips are assembled in various electronic devices such as mobile phones and personal computers. [0003] For dividing a wafer, for example, a cutting device is used. The cutting device includes: a holding table that holds a workpiece; and a cutting unit to which a ring-shaped cutting blade that cuts the workpiece is attached. The wafer is held by the holding table, and the cutting blade is rotated to cut into the wafer, thereby cutting and dividing the wafer. [0004] In addit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02H01L21/66H01L21/683
CPCH01L21/67132H01L22/12H01L21/02076H01L21/6836H01L2221/68327H01L2221/6834H01L2221/68386H01L21/304H01L21/67288H01L2221/68381H01L21/78
Inventor 酒井敏行蓝丽华
Owner DISCO CORP
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