Variable pattern light emitting diode, preparation method thereof and reflective sighting telescope
A technology of light-emitting diodes and graphics, applied in the field of sight light sources, can solve the problems of low utilization rate of light sources, and achieve the effects of improving the yield, overcoming the low yield of the die, and designing reasonable preparation steps.
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Embodiment 1
[0075] S1: Take substrate 1, grow N-type ohmic contact layer 2, N-type confinement layer 3, active region 4, P-type confinement layer 5 and P-type ohmic contact layer 6 sequentially on the surface of substrate 1 by MOCVD method to obtain epitaxy piece;
[0076] S2: Place the epitaxial wafer with the N side down and the P side up in the electron beam evaporation table, and evaporate the ITO film transparent conductive layer 7 on the P-type ohmic contact layer 6, and the ITO film covers the entire surface of the epitaxial wafer; the thickness of the ITO film is for
[0077] S3-1: Place the epitaxial wafer P on the suction cup of the coating machine, coat the photoresist, and expose the light-emitting pattern A (circle) of the light-emitting area A, and the light-emitting pattern B (circle) of the light-emitting area B, the circle Concentric with the ring, the circle is located at the center of the ring; development and etching are then carried out, and at this time, light-emi...
Embodiment 2
[0088] S1: Take substrate 1, grow N-type ohmic contact layer 2, N-type confinement layer 3, active region 4, P-type confinement layer 5 and P-type ohmic contact layer 6 sequentially on the surface of substrate 1 by MOCVD method to obtain epitaxy piece;
[0089] S2: Place the epitaxial wafer with the N side down and the P side up in the electron beam evaporation table, and evaporate the ITO film transparent conductive layer 7 on the P-type ohmic contact layer 6, and the ITO film 7 covers the entire surface of the epitaxial wafer; where the ITO film Thickness is
[0090] S3-1: Place the epitaxial wafer P on the suction cup of the coating machine, coat the photoresist, and expose the light-emitting pattern A (circle) of the light-emitting area A and the light-emitting pattern B (circle) of the light-emitting area B. Said circle is located at the center of the ring, and the circle is concentric with the ring; development and etching are carried out again, and at this time, ligh...
Embodiment 3
[0100] As described in Embodiment 1, the difference is that in step S4, the P-side electrode A and the P-side electrode B are only located in the light-emitting region, and the two through holes penetrate the active region 4 in step S6. LED structure such as image 3 shown. Luminous graphics such as Figure 7 shown.
[0101] Luminescence experiment:
[0102] Take any one of the light-emitting diodes prepared in Examples 1-3, and after lighting up, a specific light-emitting pattern can be generated, and the replacement of the light-emitting pattern can be selected according to the conduction selection of the P-surface electrode during use, and it can be completed at the same time as packaging and bonding Soldering wire, excellent when used in reflex sights.
[0103] After the light-emitting diode is manufactured, the P-side electrode A is turned on, and the generated light-emitting pattern is a dot ( Figure 6 , Figure 7 left figure); turn on the P surface electrode B, t...
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