Light-emitting device, backlight plate and display panel
A light-emitting device and backlight technology, applied in optics, nonlinear optics, instruments, etc., can solve the problems of poor stability of light loss products and high production costs
Pending Publication Date: 2022-05-20
LEXTAR ELECTRONICS CORP
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Problems solved by technology
However, the existing COB packaging technologies still have many problems such as high production cost, serious light loss and poor product stability.
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[0072]In order to make the description of the content of this disclosure more detailed and complete, the following is a descriptive description of the implementation of this disclosure and specific embodiments; this is not the only form of implementing or applying specific embodiments of this disclosure. The embodiments disclosed below may be combined or substituted with each other in useful circumstances, and may also be appended to one embodiment other embodiments without further documentation or explanation.
[0073] It will be appreciated that, although the terms "first", "second", "third" and the like may be used herein to describe various elements, constituent components, regions, layers, and / or parts, these elements, constituent components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different elements, constituent components, regions, layers, and / or parts. Thus, the first element, constituent compon...
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Abstract
The invention provides a light-emitting device, a backlight plate and a display panel. The light-emitting device comprises a substrate, a conductive layer, a first reflecting layer, a light-emitting element, a second reflecting layer and a packaging layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light-emitting element is disposed in the opening and electrically connected to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light-emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light-emitting element. A height exists between the highest point of the packaging layer and the upper surface of the first reflecting layer, and the height is 0.1-0.5 times of the outer diameter. The light-emitting device can reduce light loss.
Description
Technical field [0001] This disclosure is about a light-emitting device, a backlight panel and a display panel. Background [0002] With the advancement of light-emitting diode technology and the increase in market demand, a new display technology represented by submillimeter light-emitting diodes / micro-light-emitting diodes (Mini-LED / Micro-LED) has emerged. [0003] Mini-LED packaging mainly includes COB (Chip on Board) technology and IMD (Integrated MountedDevices) integrated packaging technology two schemes, of which COB technology is the LED chip directly packaged to the module substrate, and then the overall mold sealing of each large unit. However, the existing COB packaging technology still has many problems such as high production costs, serious light loss, and poor product stability. Contents of the Invention [0004] In view of this, the purpose of this disclosure is to propose a light-emitting device, backlight board and display panel that can solve the above problems...
Claims
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IPC IPC(8): H01L33/46H01L27/15G02F1/13357
CPCH01L33/46H01L27/156G02F1/133606H01L33/54H01L33/60H01L33/62H01L25/0753H01L2933/005H01L33/56H01L33/507H01L2933/0091H01L33/504G02F1/133614G02F1/133603H01L33/005G02F2202/36G02F1/133607G02F1/133611H01L2933/0058
Inventor 田运宜吴有章张宇礼
Owner LEXTAR ELECTRONICS CORP