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Heat dissipation device

A technology of heat dissipation device and pipeline, applied in indirect heat exchangers, heat exchanger types, lighting and heating equipment, etc., to achieve the effect of improving heat exchange efficiency, less space, and flexible space configuration

Pending Publication Date: 2022-05-20
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The second pipeline is used to circulate the second fluid

Method used

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  • Heat dissipation device
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Embodiment Construction

[0047] The following application will now be described more fully herein with reference to the accompanying drawings, in which some exemplary embodiments are shown. The present application can be implemented in various forms and should not be limited by the examples mentioned below. However, these embodiments are provided to help a more complete understanding of the contents of the present application and to fully convey the scope of the present invention to those skilled in the art. Like reference numbers will refer to like components throughout.

[0048] Please refer to figure 1 . figure 1 It is a perspective view of a heat dissipation device 100 according to an embodiment of the present application. Such as figure 1 As shown, the heat dissipation device 100 includes a first pipeline 110 and a second pipeline 120 . In some embodiments, the material for making the first pipeline 110 and the second pipeline 120 includes copper or aluminum, but the application is not limit...

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Abstract

The invention provides a heat dissipation device which comprises a first pipeline and a second pipeline. The first pipeline is used for circulating first fluid. The second pipeline is used for circulating second fluid. The second pipeline is provided with a sleeving section, an input section and an output section. The sleeving section is sleeved with one part of the first pipeline, so that a circulation channel is formed between the sleeving section and the part of the first pipeline. The input section and the output section are connected with the two ends of the sleeving section respectively. Compared with barrier caused by a double-layer metal wall and a thermal interface material in the prior art, the heat exchange efficiency can be further improved.

Description

technical field [0001] The invention relates to a cooling device. Background technique [0002] The main operating principle of the current common thermosiphon cooling device is to help the heat source dissipate heat through the phase transition between the liquid state and the gaseous state of the refrigerant. The liquid refrigerant absorbs heat at the heat source and evaporates into a gaseous state. The gaseous refrigerant is then cooled at the condensing end to condense into a liquid and flow back to the heat source. The heat dissipation efficiency of this kind of heat dissipation device depends on the cooling efficiency of the condensation end. [0003] However, at present, cryogenic liquid is used to cool the gaseous refrigerant at the condensing end. The gaseous liquid and the cryogenic liquid flow in two independent pipelines. Usually, the two independent pipelines will be in contact through thermal interface materials, so that the two liquids can be thermally balan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20809H05K7/20327H05K7/20309F28D15/0266F28D7/106F28D2021/0031H01L23/427H01L23/473F28D15/025
Inventor 童凯炀陈虹汝
Owner INVENTEC PUDONG TECH CORPOARTION