Method for recovering electroplating liquid
A technology of electroplating solution and electroplating tank, which is applied in the field of recycling electroplating solution during the electroplating process by operating vertical continuous electroplating equipment, can solve the problem of taking away more electroplating solution, and achieve the effect of cost saving
Pending Publication Date: 2022-06-03
华通电脑(惠州)有限公司
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Problems solved by technology
[0004] The invention provides a method for recycling electroplating solution, which can solve the problem that more electroplating solution will be taken away due to the use of hangers, thereby achieving the effect of saving the cost of the electroplating process
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Embodiment 1
[0028] Embodiment 1: The substrate of this embodiment is taken out from the electroplating tank through the hanger after the electroplating process. After that, the substrate is rotated in the first axial direction along its normal direction, so that the extension direction of the substrate E' There is an angle of 45° with the extension direction E of the substrate not rotated in the first axial direction. Next, after the substrate is allowed to stand for 12 seconds, the substrate is transported to the temporary storage area.
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The invention provides a method for recovering electroplating liquid. The method comprises the following steps. Firstly, a substrate subjected to an electroplating process is taken out of an electroplating bath, and electroplating liquid is stored in the electroplating bath. Next, the substrate is rotated in the first axial direction in the normal direction of the substrate, and a specific angle is formed between the extension direction of the substrate after the first axial rotation and the extension direction of the substrate that is not rotated in the first axial direction.
Description
technical field [0001] The present invention relates to a method for recovering electroplating solution, in particular to a method for recovering electroplating solution by operating vertical continuous electroplating equipment for electroplating process. Background technique [0002] When performing the electroplating process with existing vertical continuous electroplating equipment, the substrate to be electroplated is held via a hanger, wherein the top edge of the substrate is grasped from above by a plurality of clamps of the hanger. However, when the substrate is in and out of the electroplating tank, scratches are likely to occur due to collision with other components of the electroplating tank, that is, the stability of this method of holding the substrate is extremely poor. [0003] In order to solve the above problems, the substrate to be plated can be held by a hanger, wherein the edge of the substrate is surrounded by the frame body of the hanger, for example, an...
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IPC IPC(8): C25D21/18C25D21/10C25D17/08
CPCC25D21/18C25D21/10C25D17/08Y02P10/20
Inventor 季泽江黄帆
Owner 华通电脑(惠州)有限公司
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