Structure for fixing camera device and image read device therefor

Abstract

The present invention is made to provide a fixing structure for solid state image forming device made inexpensively and easily by simple caulking adhering method with keeping high positional accuracy, by which it is achieved that the solid state image forming device can be separated easily from the image focusing lens holding member when the image focusing lens holding member has a defect, In the fixing structure of present invention, an image focusing lens holding member and an intermediate holding member are adhered by caulking adhering method. Because one or more projecting portion for painting adhesive material formed on the image focusing lens holding member, have smaller area than that of bottom surface of the intermediate holding member, a space is formed between the image focusing lens holding member and the intermediate holding member, the solid state image forming device fixed on the intermediate holding member can be easily separated from the image focusing lens holding member by inserting and turning a tool whose width of top portion is smaller than the width of space.

Description

technical field [0001] The present invention relates to a fixing structure of a solid-state imaging device in image reading devices such as copiers, image scanners, and facsimile machines, an imaging module, and an image reading device having the imaging module. Background technique [0002] In image reading devices such as copiers, image scanners, and facsimile machines, a solid-state imaging device such as a so-called CCD is used for an image reading portion. The solid-state imaging device 101 such as Figure 8 As shown in (a), in general, many photoelectric conversion elements 102 with a size of several μm on one side are arranged in a row, and in an image reading device, such as Figure 9 As shown, the structure is such that the image of the document 103 is imaged using the imaging lens 104, and then the image is read. Also, recently, for reading color images, such as Figure 8 As shown in (b), there is sometimes used a solid-state imaging device for color images in whic...

AI Technical Summary

Problems solved by technology

[0019] In this way, the non-faulty parts are also scrapped together with the faulty parts bonded to them, which increases the cost, reduces the manufacturing efficiency, and goes against the trend of saving resources. It is also a problem from the viewpoint of environmental protection, especially for solid-state imaging devices. and circuit boards mounted on solid-state imaging devices are expensive parts, so scrapping these non-faulty parts is a serious problem

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