Integrated circuit component element and manufacturing method of micro electromechanical system
A technology of micro-electromechanical systems and integrated circuits, which is applied in the manufacture of semiconductor/solid-state devices, circuits, electrical components, etc., can solve the problems of reducing the contact area, increasing the metal layer 4 to fill the via holes, etc., so as to reduce difficulties and omit the dielectric Effects of layer steps
Inactive Publication Date: 2006-05-31
MACRONIX INT CO LTD
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[0005] In the above traditional manufacturing method, since the metal layer 4 is in contact with the thermal resistor 2 through the via hole 5, not only the contact area between the thermal resistor 2 and the metal layer 4 is reduced, but also the problem of filling the via hole 5 when the metal layer 4 is deposited increases.
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[0013] For clarity, please also refer to Figure 2-7 Schematic diagram of the manufacturing method of the embodiment of the present invention, taking the manufacture of micro-electromechanical nozzles as an example. The right side is part of the integrated circuit device 20 , and the left side is part of the micro-electromechanical device 30 .
[0014] First, a semiconductor substrate 10 is provided, wherein the above-mentioned semiconductor substrate 10 may have an integrated circuit device 20 (for example, CMOS), such as figure 2 shown. The material of the aforementioned semiconductor substrate 10 is, for example, a silicon wafer or a GaAs substrate, on which any desired semiconductor components can be formed, such as CMOS transistors, resistors, logic components, etc. It is indicated on a flat substrate. A layer of insulating layer 110 is deposited on the aforementioned semiconductor substrate 10, which can be boron phosphorous glass (BPSG) or phosphorous glass (PSG). ...
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Abstract
A method of manufacturing integrated integrated circuit components and micro-electro-mechanical systems, comprising the following steps: providing a substrate with an integrated circuit (IC) component area and a micro-electro-mechanical system component area, wherein the integrated circuit component area is formed with an integrated circuit component Depositing an insulating layer on the above-mentioned integrated circuit component area and the micro-electro-mechanical system component area; etching the above-mentioned insulating layer to form a plurality of guide holes in the integrated circuit component area; forming a structural layer on the above-mentioned micro-electro-mechanical system component area; depositing a The metal layer is on the above-mentioned substrate and filled into the above-mentioned plurality of guide holes; forming a thermal resistance on the above-mentioned MEMS component area and directly contacting the above-mentioned metal layer; and etching the above-mentioned metal layer to define a metal circuit.
Description
technical field [0001] The invention relates to a manufacturing method for integrating an integrated circuit component and a micro-electromechanical system, in particular to a method for integrating a thermal resistance and a bonding metal in an inkjet head and an integrated circuit component in a direct contact manner. Background technique [0002] In the general manufacturing method, since the micro-electromechanical and integrated circuit manufacturing plants are usually separate manufacturers, the integrated circuit device and the micro-electro-mechanical component are divided into two independent manufacturing processes. Therefore, all integrated circuit devices are usually completed first in the integrated circuit manufacturing plant. After the manufacturing method, it is sent to the MEMS manufacturing plant for the manufacturing method of the MEMS component. [0003] However, in the manufacturing methods of integrated circuit devices and micro-electro-mechanical compo...
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IPC IPC(8): B81C1/00H01L21/70
Inventor 江禄山朱世麟
Owner MACRONIX INT CO LTD