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Metal laminating body

A metal laminate, polyimide technology, applied in metal layered products, layered products, adhesive additives, etc., can solve problems such as deterioration of yield

Inactive Publication Date: 2006-12-06
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the spraying method is used, since the bubbles in the metal layer are easy to deteriorate the yield, it is desirable to have a bubble-free polyimide metal laminate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] Add 1,3-bis(3-aminophenoxy)benzene 12.00 g, 1,3-bis(3-maleimidephenoxy)benzene 15.94 g and 48.70 g of N,N-dimethylacetamide was stirred at 50° C. for 1 hour under a nitrogen atmosphere. Then the system was lowered to room temperature, while paying attention to the rise of the solution temperature, 11.90 g of 3,3',4,4'-benzophenone tetracarboxylic dianhydride was added in batches, and then the temperature was raised to 50° C. and stirred for 4 Hour.

[0097] A portion of the polyamic acid solution containing the obtained bismaleimide compound was taken out, cast on a glass plate, and then heated from 50° C. to 270° C. at a rate of 7° C. / min to obtain a film with a thickness of 20 μm. The glass transition temperature (Tg) of the obtained polyimide film was 106°C.

[0098] Separately, a part of the polyamic acid solution containing the obtained bismaleimide compound was cast on a copper foil (manufactured by Nippon Denya Co., Ltd., SLP-35, thickness 35 μm), and the tempe...

Embodiment 2~4

[0102] The polymerization, compounding and evaluation were carried out in the same manner as in Example 1 except that the type and compounding amount of the diamine compound or bismaleimide compound were changed. Table 1 shows the results. The 1,3-bis(3-(3-aminophenoxy)phenoxy)benzene and 1,3-bis(3-(3-(3-aminophenoxy)phenoxy)benzene used at this time oxy)benzene and 1,3-bis(3-(3-maleimidephenoxy)phenoxy)benzene use 1 Identification by H-NMR and FD-mass spectrometry.

[0103] 1,3-bis(3-(3-aminophenoxy)phenoxy)benzene: 1 H-NMR (CD 3 SOCD 3 )δ: 5.24(s, 4H), 6.12-6.16(ddd, 2H, J=7.83, 2.43, 0.82Hz), 6.23(t, 2H, J=2.30Hz), 6.33-6.37(ddd, 2H, J= 7.83, 2.43, 0.82Hz), 6.61(t, 2H, J=2.43Hz), 6.67(t, 1H, J=2.43Hz), 6.71-6.80(m, 6H), 6.99(t, 2H, J=7.83 Hz), 7.35(t, 2H, J=7.83Hz), 7.38(t, 1H, J=7.83Hz) FD-mass spectrum 476(M+) 1,3-bis(3-(3-(3-aminophenoxy Base) phenoxy) phenoxy) benzene: 1 H-NMR (CD 3 SOCD 3)δ: 5.21(s, 4H), 6.11-6.12(ddd, 2H, J=7.83, 2.16, 0.81Hz), 6.21(t, 8H, J=...

Embodiment 5

[0106] Add 855 g of N,N-dimethylacetamide as a solvent to a container equipped with a stirrer and a nitrogen gas introduction tube, add 69.16 g of 1,3-bis(3-aminophenoxy)benzene therein, and dissolve at room temperature and stir. Then, 75.84 g of 3,3',4,4'-benzophenone tetracarboxylic dianhydride was added, and stirred at 60°C to obtain a polyamic acid solution. The content of polyamic acid was 15% by weight. 48.3 g of 1, 3- bis (3-maleimide phenoxy) benzene was added to 500 g of some obtained varnishes, and it stirred at room temperature for 2 hours.

[0107] Using a commercially available polyimide resin film (manufactured by Toray Dupon Co., Ltd., trade name: Capton (registered trademark) 150EN), the obtained bismaleimide compound-containing polyamic acid solution was prepared by the aforementioned method. Part of it is coated with a rubber roller so that the thickness after drying is 2 μm, and dried in an air cushion drying oven at 115°C for 2 minutes, at 150°C for 2 min...

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Abstract

Provided is a heat resistant resin composition having excellent adhesiveness at a low temperature and to provide a polyimide metal laminate hardly generating swell during lead-free solder, Au-Sn jointing used for COF mounting or Au-Au jointing and showing excellent solder heat resistance.The metal laminate is produced by laminating a resin composition obtained by compounding a polyamic acid and / or a polyimide to a bismaleimide compound represented by the general formula (1) on at least one surface of a metal foil (m is an integer of 0 or more; bonds X are O, SO2, S, CO, CH2, C(CH3)2, C(CF3)2or a direct bond and may be independently identical or different; and substiotuents R1 are each a hydrogen atom, a halogen atom or a hydrocarbon group and may be identical or different, and their substitution positions in a benzene ring are mutually independent).

Description

technical field [0001] The present invention relates to a resin composition for a metal laminate and a polyimide laminate that is excellent in low-temperature adhesiveness and excellent in solder heat resistance. Background technique [0002] Due to its excellent heat resistance, chemical resistance, mechanical strength, and electrical properties, polyimide is not only suitable for use in the aerospace field requiring heat resistance, but also suitable for use in flexible printed substrates and semiconductor packages. The representative electronics field is used as a heat-resistant adhesive. [0003] In recent years, polyimide-based heat-resistant adhesives have been required to have so-called low-temperature adhesive properties in addition to processability and heat resistance. [0004] As a material excellent in low-temperature adhesiveness, for example, Patent Document 1 reports a resin composition composed of a polyimide resin having a siloxane unit, an epoxy resin, and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08C09J179/08
CPCB32B7/12B32B15/08C09J9/00C09J11/06C09J179/08C09J2400/163
Inventor 児玉洋一森峰宽田代雅之大坪英二中泽巨树田边健二
Owner MITSUI CHEM INC