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Remote semiconductor testing method and apparatus

A semiconductor and remote technology, which is applied in the direction of semiconductor/solid-state device testing/measurement, measuring devices, and using remote testing to detect faulty hardware. It can solve the problems of non-production organizations entrusting others to test, lack of resources, and difficulties

Inactive Publication Date: 2002-05-01
克雷登斯系统公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because monitoring is difficult, preventable errors in design, assembly, or other steps may not be avoided, and while non-production facilities wish to run test programs themselves to expedite inspection of test data, they may lack the resources needed
In this case, the non-production organization may have to commission others to test or rent the equipment of the test house

Method used

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  • Remote semiconductor testing method and apparatus
  • Remote semiconductor testing method and apparatus
  • Remote semiconductor testing method and apparatus

Examples

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Embodiment Construction

[0019] In order to speed up the development process and reduce costs for semiconductor manufacturing, some companies such as non-fabrication facilities may wish to have the ability to remotely monitor (as in their own facilities), analyze and run IC tests at all stages of designing, debugging and fabricating new ICs program.

[0020] The test system is generally provided by the "master user", which has its own or leased test equipment. The host customer may be an entity such as the "test house" mentioned above, or it may be part of an integrated device manufacturer that provides testing services to others such as non-production organizations. The test system may be a machine with or without auxiliary instruments for semiconductor circuit testing, such as the Model ITS9000KX tester sold by Schlumberger Semiconductor Solution, San Jose, CA, which has high throughput and high accuracy Advantageously, a large number of semiconductor circuits can then be quickly tested. Auxiliary...

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PUM

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Abstract

An apparatus is disclosed for remotely monitoring and developing steps in a semiconductor manufacturing process that includes, at least one remote workstation connected via a remote access link to a local workstation, and a test system connected via a link to the local workstation. A method is also disclosed that includes running a semiconductor test system remotely, monitoring the semiconductor test system remotely, and receiving data from the semiconductor test system remotely. Another embodiment includes an apparatus for remotely monitoring and developing steps in a semiconductor manufacturing process. This embodiment includes a plurality of remote workstations each connected via a remote access link to a local workstation, and a test system connected via a link to a local workstation. Security features in this embodiment prevent any one remote workstation from accessing any other remote workstation.

Description

[0001] Field [0002] The present invention relates to integrated circuit (IC) design and manufacture, and more particularly to IC design and chip test systems remote from test equipment. Background technique [0003] As newly developed ICs become increasingly complex, new IC manufacturing techniques are developed. Today IC manufacturers typically use one of several possible routes to manufacture their products. First, manufacturers may build and operate their own factories to produce semiconductors themselves. These factories are semiconductor fabs. Some companies only operate such fabs, leaving other companies to develop new ICs. Many large companies called "integrated device manufacturing" (IDM) have the ability to design and test new semiconductors, which also have their own manufacturing plants. Instead, a company can limit itself to designing ICs while others manufacture them. Traditionally, manufacturers are IDM companies, and many manufacturing plants are built by s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01R19/25G06F17/50G06F19/00H01L21/00H01L21/02
CPCG06F11/2294G01R31/31718
Inventor 弗雷德里克·W·克里斯特蒂莫西·J·瓦格纳
Owner 克雷登斯系统公司