Mfg. method of lining processor and semiconductor device

Abstract

A substrate processing apparatus and a method for manufacturing a semiconductor device can supply the vapor of the raw material to the substrate without fail. A main heater 22 is prepared outside the outer tube 21, an inner tube 23 is prepared inside the outer tube 21, a cap 24 that can be lifted and lowered is inserted in the inner tube 23, a boat 25 is mounted on the cap 24, a raw material sublimation portion 46 and a heat insulating portion 36 are prepared on the cap 24, a heater portion 45 is set up with possible attachment and detachment on the cap 24, a sublimation heater 26 of the heater portion 45 is located inside the reaction chamber, a raw material loading board 34 of the raw material sublimation portion 46 is prepared on the upper portion of the sublimation heater 26, a plurality of pole members 35 are prepared around the raw material loading board 34, the heat insulation portion 36 is supported by the pole member 35, and the heat insulating portion 36 is located between the raw material sublimation portion 46 and the substrate processing area, and the heat insulating portion 36 is packed with a quartz wool.

Description

technical field [0001] The present invention relates to a sublimation antimony oxide (Sb 2 o 3 ) and other raw materials are provided to a substrate such as a semiconductor substrate and a method for manufacturing a semiconductor device. Background technique [0002] Figure 7 is a schematic cross-sectional view showing a conventional substrate processing apparatus. As shown in the figure, a heater 2 is arranged outside the outer casing 1, an inner casing 3 is arranged inside the outer casing 1, a liftable cover 4 is inserted into the inner casing 3, and a port is installed on the cover 4. 5. A plurality of semiconductor substrates (not shown) are held in the port 5 . In addition, a raw material sublimation device 6 is arranged outside the outer casing 1 and the inner casing 3, that is, outside the furnace, and one end of the raw material introduction pipe 7 is connected to the raw material sublimation device 6, and the other end of the raw material introduction pipe 7 is...

AI Technical Summary

Problems solved by technology

However, in the current manufacturing line of semiconductor devices as the mainstream Figure 7 In the case of the shown vertical device (that is, the reaction tube is arranged in the vertical direction), due to the problem of restricting the height of the clean room where the device is installed, such as Figure 7 As shown, the length of the furnace core tube does not simply become longer in the vertical direction

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