Cases of electronic devices and mfg. methods

A technology for electronic devices and manufacturing methods, which are applied to electrical equipment casings/cabinets/drawers, electrical components, metal casings, etc., can solve problems such as insufficient structural strength and inability to meet the requirements of thin and light casings.

Inactive Publication Date: 2003-07-23
QUANTA COMPUTER INC +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the advancement of the times, electronic devices such as notebook computers, mobile phones, and PDAs tend to make their shells thinner and smaller. However, many electronic consumer products often ignore the problem of insufficient structural strength for this light and thin requirement.
[0003] In detail, to meet the requirement of making the casing ultra-thin, the existing casing may only be made of a titanium alloy, resulting in insufficient structural strength; Reinforcement at a specific position, but if the structural strength is to be reinforced by plastic, the plastic material must have sufficient thickness, which cannot meet the requirements of making the shell lighter and thinner

Method used

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  • Cases of electronic devices and mfg. methods
  • Cases of electronic devices and mfg. methods
  • Cases of electronic devices and mfg. methods

Examples

Experimental program
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Effect test

Embodiment Construction

[0017] refer to figure 1 , a general electronic device 1, such as a notebook computer, has a casing 10 composed of different parts, Figure 2a A part of the housing 10 is shown, and through a section on the housing 10, such as Figure 2b , Figure 2c and Figure 2d As shown, it can be seen that the casing 10 of the present invention is formed by a first component 11 and a second component 12 .

[0018] refer to Figure 2b , the electronic device 1 has a plurality of elements 20 (only one is shown in the figure), and the second member 12 is disposed on the first member 11, and the second member 12 has a step portion 121 corresponding to the element 20, and the second The member 12 is closer to the element 20 than the first member 11 , and it should be noted that the number of step portions 121 formed corresponds to the number of elements 20 provided.

[0019] Moreover, the casing 10 further includes a glued portion 13 located between the first member 11 and the second memb...

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PUM

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Abstract

The invention relates to the method for mfg. cases of electronic devices. The electronic device contains at least one element. The method includes following steps. First, using the first metal material to form the first component. Then, using the second metal material to form the second component. At least one sectional difference part is formed on the second component. Finally, with the manner of the second component going closer to the element and the sectional difference part corresponding to the element, the first component and the second component are assembled as the case of the electronic device. The method makes cases meet the requirement of lightweight, thin short and small, meanwhile the structure intensity is maintained.

Description

technical field [0001] The invention relates to a housing of an electronic device and a manufacturing method thereof, in particular to a housing of an electronic device and a manufacturing method thereof which can not only make the housing light, thin and short but also maintain structural strength. Background technique [0002] With the advancement of the times, electronic devices such as notebook computers, mobile phones, and PDAs tend to make their shells thinner and smaller. However, many electronic consumer products often ignore the problem of insufficient structural strength for this light and thin requirement. . [0003] In detail, to meet the requirement of making the casing ultra-thin, the existing casing may only be made of a titanium alloy, resulting in insufficient structural strength; However, if the structural strength is to be reinforced by plastic, the plastic material must have a sufficient thickness, which cannot meet the requireme...

Claims

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Application Information

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IPC IPC(8): H05K5/00H05K5/04
Inventor 粱渊程颜伟政徐志明吴佳惠
Owner QUANTA COMPUTER INC
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