126results about How to "Maintain structural strength" patented technology

A substrate having an undulating surface forming a series of rounded peaks and valleys that produce a continuously curving surface across at least a portion of the substrate. The undulating surface defines a first set of micro features. A second set of micro features molded on the first set of micro features. The substrate is a compression molded polymeric material in which the first and second sets of micro features are formed on the substrate during a single molding step, and wherein the first and second sets of micro features cooperate to increase the surface area and affect at least one of adhesion, friction, hydrophilicity and hydrophobicity of the substrate.

A filtration system is provided with filter media operable to remove solids, particulate and colloidal matter from a process fluid. The filtration system may include one or more porous membranes which are anchored or secured on their periphery with a large open work area operable to remove selected components from the process fluid. The filter media may include an envelope formed from two membrane sheets with a spacer element disposed there between. A chamber or collection zone may be formed within the envelope to receive clarified fluid separated from the process fluid. Alternatively, the filter media may be multiple layers of spiral wound membranes or a roll of membranes.

A floating fastener includes a mounting socket bonded to a first plate member and having a beveled top mounting flange, a cap member axially slidably coupled to the mounting socket, an expandable stop ring mounted in a locating groove in the bottom side of the cap member to facilitate coupling of the cap member to the mounting socket and to prohibit the cap member from moving upwardly over the top mounting flange of the mounting socket, a locking member affixed to the cap member for fastening to a second plate member to lock the first and second plate members together, and a spring member sleeved onto the locking member and stopped between the head of the locking member and a shoulder in the mounting socket.

A relatively lightweight, modular, blast control system utilizes a plurality of fabric panels that may be joined to form a matrix or blanket to protect or control the blast. The panels are preferably made from layers of auxetic woven fabric, with each successive fabric layer oriented between 0-90 degrees from the previous layer. The panels may be connected together via a locking mechanism or assembly comprising a cable which runs the length of the perimeter of each fabric panel, and a torque pin rotated about two adjoining cables to form an interlocking connection. The panels connected in this manner form the fully assembled blast control blanket.

Provided is a folding bicycle comprising two auxiliary rear wheels at both sides of a rear wheel; a seat including a seat tube extended downward; a first crossbar having a front end pivotably connected to a lower portion of a handle above a front wheel, and a rear end fixedly connected to an intermediate portion of the seat tube; a pair of second crossbars having two front ends pivotably connected to an intermediate portion of the handle, and two rear ends fixedly connected to both ends of an hub of the rear wheel. The first crossbar passes an intermediate portion of the second crossbar and is pivotably connected thereto. A flexible shock absorbing means is provided at a joining portion of the seat tube and the second crossbars. The shock absorbing means is adapted to elastically deform when a downward force is exerted on the seat.

Disclosed is a method or process for forming a glass wiring board substrate for integrated circuit wiring boards, including providing a first molding surface (20) positioned on a first mold (22) having truncated conical pins (24) protruding therefrom, the pins (24) having a diameter at the top end (26) thereof of 150 micrometers or less, and a minimum pitch (28) of 400 micrometers or less, providing a glass sheet (30) having first and second surfaces (32,34) on opposite major sides thereof, pressing the first surface (32) of the glass sheet against the molding surface (20), heating the glass sheet (30) and the first molding surface (20) together to a temperature sufficient to soften a glass of which the glass sheet (30) is comprised, such that the pattern of the first molding (20) surface is replicated in the first surface (32) of the glass sheet (30), thereby producing a formed glass sheet (30′) having an array of holes (40) therein, cooling the formed glass sheet (30′) and the molding surface (20) together to a temperature below the softening point of said glass, and separating the formed glass sheet (30) from the molding surface (20). The forming may press the glass sheet using one mold surface or two mold surfaces simultaneously. For embodiments using a single mold, the holes may be blind holes after pressing, and may then be opened to form through-holes by back side lapping. Alternatively, the glass is pressed up to through-hole formation, avoiding the need of back side lapping.

The invention relates to a grouting method for a blast furnace, aiming to enhance the grouting success rate of the blast furnace. In the invention, the temperature of a furnace shell of the blast furnace is measured by using infrared imaging scanning and an infrared temperature measuring instrument to find out the position with relative high temperature; the position is taken as a datum point, holes are bored at vertical or transverse interface parts between two cooling walls or among three cooling walls which are adjacently installed at the upper side, the lower side, the left side and the right side; a hollow drill is used to drill through the furnace shell firstly, then drill through fillers between the furnace shell and the cooling wall, continuously drill a hole forwards to drill through the cooling wall, and then drill through unshaped ramming materials or pouring materials between a brick lining and the cooling wall; a drilling channel is cleaned; a grouting channel is dredged,lubricated and preheated; and an amount upper limit value of grouting is controlled to be 60 kg to 120 kg; proper grouting pressure is ensured, when the brick size of the brick lining is small and isnot provided with a brick locking groove, the grouting pressure is relative low to be generally controlled to be 1.0 MPa-1.5 MPa, and when the brick size of the brick lining is large and is provided with the brick locking groove, the grouting pressure is relative high to be generally controlled to be 1.0-3.0 MPa.

The invention relates to the method for mfg. cases of electronic devices. The electronic device contains at least one element. The method includes following steps. First, using the first metal material to form the first component. Then, using the second metal material to form the second component. At least one sectional difference part is formed on the second component. Finally, with the manner of the second component going closer to the element and the sectional difference part corresponding to the element, the first component and the second component are assembled as the case of the electronic device. The method makes cases meet the requirement of lightweight, thin short and small, meanwhile the structure intensity is maintained.

A metal thermal stud/plate has a center web with geometrically-shaped apertures spaced longitudinally along its centerline. The apertures define alternatingly-positioned narrow necks of material therebetween near ends of the center web. The narrow necks minimize thermal conductivity between the spaced flanges, but adjacent ones of the narrow necks are longitudinally misaligned due to their alternating positions to thus prevent forming a weak longitudinally-extending fold line in the stud/plate, thus maintaining its strength. In one form, the narrow necks are at most about 0.100 inches wide without substantially degrading the strength of the studs/plates, or can be a ratio of neck width to center web of as low as 0.09:4 down to 0.03:4. A building wall frame includes a plurality of the metal studs/plates and foam insulated panels with edges engaging the center webs of adjacent studs/plates to thus stabilize the metal studs/plates.

In one embodiment of the present invention, a method for fabricating semiconductor devices comprises forming an active region about a front-side of a substrate. A plurality of trenches are then formed about a back-side of the substrate. A grid of banks separates the trenches. A conductive material is then applied to the back-side of the substrate. The trenches and the conductive material act to reduce the on-state resistance of the substrate and enhance thermal conductivity, while the grid of banks maintains the structural strength of the wafer.

A press key structure includes a bottom board, an insulating plate, a thin film circuit board, an elastic trigger element, and a keycap covered onto the elastic trigger element, and the insulating plate is installed on the bottom board and includes a penetrating hole, and the thin film circuit board is covered onto the insulating plate, and the thin film circuit board and the bottom board are enclosed to define a containing space at a position corresponding to the penetrating hole, and the thin film circuit board includes a thin film switch disposed above the containing space, and the elastic trigger element is installed above the thin film circuit board, such that external dusts can be prevented from entering into the press key structure from the penetrating hole, and the adverse effect of the dusts on the electric connection and the press path of the press key can be avoided.