Disclosed is a method or process for forming a glass wiring board substrate for
integrated circuit wiring boards, including providing a first molding surface (20) positioned on a first mold (22) having truncated conical pins (24) protruding therefrom, the pins (24) having a
diameter at the top end (26) thereof of 150 micrometers or less, and a minimum
pitch (28) of 400 micrometers or less, providing a
glass sheet (30) having first and second surfaces (32,34) on opposite major sides thereof, pressing the first surface (32) of the
glass sheet against the molding surface (20), heating the
glass sheet (30) and the first molding surface (20) together to a temperature sufficient to soften a glass of which the glass sheet (30) is comprised, such that the pattern of the first molding (20) surface is replicated in the first surface (32) of the glass sheet (30), thereby producing a formed glass sheet (30′) having an array of holes (40) therein, cooling the formed glass sheet (30′) and the molding surface (20) together to a temperature below the
softening point of said glass, and separating the formed glass sheet (30) from the molding surface (20). The forming may press the glass sheet using one mold surface or two mold surfaces simultaneously. For embodiments using a single mold, the holes may be blind holes after pressing, and may then be opened to form through-holes by back side lapping. Alternatively, the glass is pressed up to through-hole formation, avoiding the need of back side lapping.