Placode treating method and treater

A substrate processing method and substrate technology are applied in the directions of cleaning methods and utensils, chemical instruments and methods, cleaning methods using liquids, etc., and can solve the problems of reducing pure water, increasing consumption of carbon dioxide gas, increasing consumption of pure water, etc. To achieve the effect of reducing consumption and usage

Inactive Publication Date: 2004-09-22
DAINIPPON SCREEN MTG CO LTD
View PDF1 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology describes an improved process for cleaning semiconductor wafers during manufacturing processes such as chemical mechanical polishing ("CMP"), electroplating, etchback treatment, etc., which involves treating them with different types of liquids at specific times while minimizing waste by recirculation of spent rinse fluids containing impurities like ammonia. By doing this, more efficient use of purified solvents reduces costs compared to traditional methods involving multiple steps. Additionally, the reuse of used rinser liquid helps prevent corrosion caused by excess acidic materials present on surfaces being processed. Overall, these improvements improve overall performance and efficiency of wafer production.

Problems solved by technology

Technological Problem: Current Liquid Dry Plasma Display Sheet Process Apparatus described in UV Disclosure describes a method called wet removal process for removing residue left over after coating metal sheets during manufacturing processes like lithography. However, current methods have issues related to use of purified water due to incomplete separation between different chemical solutions present within each step. Additionally, existing systems require separate supplies of purewater throughout the entire system leading to increased costs associated with waste disposal operations.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Placode treating method and treater
  • Placode treating method and treater
  • Placode treating method and treater

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Below, refer to figure 1 with figure 2 The best embodiment of the present invention will be described.

[0029] figure 1 It shows an example of an embodiment of the present invention, and is a schematic front sectional view showing a schematic configuration of a substrate processing apparatus. In this figure, only the water washing treatment part is shown. A detachment processing unit is provided adjacent to the water rinsing treatment unit 10 on the preceding stage side of the water rinsing treatment unit 10 , but since the detachment treatment unit has been described above, its description is omitted here.

[0030] The water washing treatment unit 10 is equipped with a processing chamber 12 having an inlet-side opening 14 and an outlet-side opening 16. Inside the processing chamber 12, a roller conveyer that supports the substrate W in a horizontal posture or a slightly inclined posture and conveys it horizontally is arranged. Machine 18. The substrate W in a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Provided is a method in which the consumption of a rinsing liquid (pure water) can be reducible when a substrate is processed by supplying the rinsing liquid to the surface of the substrate. In the beginning when the substrate W has been carried in a processing chamber 12 of a washing process part 10, the rinsing liquid is supplied from an entrance nozzle 20 and an upper spray nozzle 22 to the substrate, and after that, the rinsing liquid is supplied from the upper spray nozzle 22 and a lower spray nozzle 24 to the substrate until the substrate is carried out of the processing chamber 12.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products