Wire structure of indicator

Abstract

Multiple conducting wires setup at first conducting wire zone and second conducting wire zone of basal plate are extended along first direction and second direction. The first conducting wire zone is adjacent to second conducting wire zone. Conducting wires in second conducting wire zone includes a first conducting wire and multiple second conducting wires. Distance between the end point of first conducting wire and third conducting wire in first conducting wire zone is smaller than distance between the end point of second conducting wire and third conducting wire. Multiple bonding pads are setup on second basal plate. Conducting wires through glue material are connected to the said pads electrically.

Description

technical field [0001] The invention relates to a wire structure, in particular to a wire structure of a display. Background technique [0002] In many electronic devices today, the connection between components and the main circuit is accomplished through anisotropic conductive film (ACF). The anisotropic conductive film is composed of non-conductive synthetic resin and conductive particles. The diameter of the conductive particles is generally 3 to 5 microns. The inside is made of polymer material, and the outside is made of gold, nickel, etc. Or metal conductors such as tin to coat it. [0003] Anisotropic conductive film is often used in the manufacturing process of liquid crystal displays, for example, the process of directly bonding the driver chip of the panel to the glass substrate (commonly referred to in the industry as COG, that is, chip on glass), or bonding the driver chip to the soft The process of bonding the chip to the substrate (COF, or chip on FPC), or t...

AI Technical Summary

Problems solved by technology

[0008] When the wires 22 are arranged in the horizontal direction, the conductive particles 24' cannot flow out smoothly due to the increase of the path required for the flow of the conductive particles 24' and the adjacent geometric configuration of the horizontal wires and the vertical wires, resulting in particle aggregation. like figure 2 and Figure 4 As shown in the A place, the upper and lower electrodes (wire 22 and connection pad 20) cannot be effectively connected

[0009] In addition, when the wire 22 is designed to be extended, the required flow path relative to the conductive particles 24' will be increased, and its flow speed must be increased at the same time, so it is often impossible to provide the conductive particles 24' more effectively and efficiently due to structural design restrictions. The rapid flow causes the upper and lower electrodes (wire 22 and connection pad 20) to be unable to connect and conduct

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