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Piezoelectric component and production method therefor

A piezoelectric component and piezoelectric element technology, which is applied in the manufacture/assembly of piezoelectric/electrostrictive devices, electrical components, piezoelectric devices/electrostrictive devices, etc. The volume and height of the filter and SAW filter cannot be reduced, and the volume of the package is expensive to reduce

Inactive Publication Date: 2005-01-12
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the above structure has a problem in that, even in the case where the volume of the piezoelectric filter and the surface acoustic wave filter element is reduced, unless the volume of the package is reduced, the volume and height of the piezoelectric filter and the surface acoustic wave filter cannot be reduced
Also, there is the problem that reducing the size of the package is expensive
However, conductive pads for matching bumps must be formed on the SAW element, which reduces the effective area of ​​the SAW element, so it is difficult to reduce the volume
Formation of bumps increases cost

Method used

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  • Piezoelectric component and production method therefor
  • Piezoelectric component and production method therefor
  • Piezoelectric component and production method therefor

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0108] Refer below Figures 1 to 3 , Figures 13 to 17 A first embodiment of the present invention is described.

[0109] In this example, as in image 3 The SAW filter 51 shown in is described in which the SAW element (piezoelectric element) 6 and the connection plate 20 are combined together with the adhesive layer 21 into a chip-sized package. The SAW element 6 has at least an IDT (oscillating portion) 2 and conductive pads (element wiring) 3 on the face facing the connection board 20 . On the side facing the SAW element 6, the connection board 20 has the excitation part 16 of the protection recessed structure (concave wall), and protects the surface acoustic wave excitation part of the IDT2 when it is combined with the SAW element 6 (prevents the IDT from contacting the connection board) . The thicknesses of the excitation portion 16 of the protection recess structure and the adhesive layer 21 ensure a space for protection of the excitation portion of the surface acous...

no. 2 example

[0142] Refer below Figures 4 to 6 , Figures 18 to 22 Another embodiment of the present invention is described. Note that, for convenience of description, components having the same functions as those explained in the first embodiment above are denoted by the same numerals, and thus descriptions thereof are omitted.

[0143] as in Figure 6 As shown in , in this embodiment, a SAW filter 52 is described in which the SAW element 26 and the connecting plate 30 are bonded together with the adhesive layer 32 . With this embodiment, the excitation portion of the protective recess structure of the first embodiment is not formed, and the space for protecting the IDT is ensured by the thickness of the resin layer 8 .

[0144] Refer below Figures 4 to 6 , a method of manufacturing the above-mentioned SAW filter is described in detail.

[0145] First, as in Figure 4 As shown in , in step 1, a SAW element 26 is fabricated. For example, LiTaO with a thickness of 0.35mm and a diam...

no. 3 example

[0169] Refer below Figure 7 , to describe another embodiment of the present invention. Note that, for convenience of description, components having the same functions as those explained in the first and second embodiments above are denoted by the same numerals, and thus descriptions thereof are omitted.

[0170] From the present embodiment, the conductive pad through hole 38 and the positioning mark through hole 19 are formed on the connection board 20 by laser in the above second embodiment.

[0171] That is to say, by Figure 7 Steps 1 to 3 shown in , instead of steps 3 and 4 in the second embodiment, manufacture the connecting plate 30 . That is, in Step 3 of the second embodiment, the resist pattern 12 is formed on the entire surface instead of being formed by photolithography (Step 1). In step 4, etching is effected by a laser, thus forming the conductive pad vias 38 and the alignment mark vias 19 (step 2). In this way, the photolithography step can be omitted and th...

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Abstract

Provided is a piezoelectric component capable of being reduced in size and enhanced in the degree of freedom in positioning an external terminal, and to provide a manufacturing method thereof. In a surface acoustic wave device, an SAW element 6 having IDTs 2 formed on a piezoelectric substrate and conductive pads 3 connected with the IDTs 2 is joined to a joining substrate 20 having through holes 18 for conduction pads by an adhesive 21 so as to face the IDTs 2. A protection space is formed by a hollow structure 16 for protecting the excitation portion of surface acoustic wave of the IDTs 2 etc. Also, an external terminal 22 connected with the conductive pads 3 via the through holes 18 is positioned so as to be deviated from the through holes 18.

Description

technical field [0001] The present invention relates to piezoelectric components, such as: surface acoustic wave devices for delay lines, filters, etc.; to piezoelectric film filters, etc.; Background technique [0002] In recent years, reducing the size and weight of electronic equipment has led to a demand for increased functionality of electronic components. Against this background, there is also a demand for reducing the volume and weight of piezoelectric parts, such as surface acoustic wave filters (hereinafter referred to as SAW filters) of surface acoustic wave devices used in communication equipment such as mobile phones, etc., using piezoelectric Piezoelectric filters with electric thin film resonators. [0003] The piezoelectric filter includes a piezoelectric resonator with an Si substrate at the opening or a concave wall, and a thin film with at least one or multiple piezoelectric films (such as ZnO or AlN) formed on the substrate with the opening or concave wal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/09H01L41/187H01L41/22H01L41/23H01L41/29H01L41/313H03H3/08H03H9/05H03H9/25H03H9/56H03H9/64
CPCH03H9/1092H03H9/0547H03H9/564H03H9/568H03H9/0542H03H9/105H03H3/08H03H9/6483H03H9/25H03H9/15
Inventor 越户义弘
Owner MURATA MFG CO LTD