Cooling apparatus

Abstract

The present invention discloses one kind of cooling device set inside casing of electronic equipment to cool the whole system inside the casing. The electronic equipment has one tail part with at least one electronic part. The cooling device includes one refrigerating chip with cold surface adhered to the casing of the electronic equipment and hot surface; one metal frame configured inside the casing of the electronic equipment and coupled to the cold surface to conduct the cold airflow. The cold airflow convects with the heat the electronic elements inside the casing to carry the heat to the tail of the casing. The metal frame matching with the fan can dissipate the heat of all the electronic parts inside the electronic equipment.

Description

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AI Technical Summary

Benefits of technology

This technology allows an improved cooling device with multiple components connected together without being restricted on one part only at once or requiring more space than what was previously possible due to its use of a metallic framework attached to the chilled plate's surface.

Problems solved by technology

This patented describes an improved way for computers with powerful processors to dissipate their excessive amount of thermal energy without losing performance. However, this improvement does little if anything about how much more efficient these systems are at once.

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