Optical apparatus for measuring the two and three-dimensional shape of an object

Abstract

The present invention provides a two-dimensional and three-dimensional optical measuring instrument, which can alternately or selectively measure two-dimensional dimensions and three-dimensional characteristics of an object, and does not use reflected light from a reference plane but only uses a projected grid for measurement The three-dimensional characteristics of the object, thereby minimizing measurement errors. The instrument includes: a CCD camera, the CCD camera is mounted on the top of the probe housing, and is used to generate two-dimensional and three-dimensional images of objects through an imaging lens; a first lighting system, the first lighting system is mounted on the CCD camera below, and illuminate the measurement surface of the measured object when measuring the two-dimensional size of the object; the second lighting system, the second lighting system is installed below the first lighting system and connected to the bottom of the probe housing (10) On the image pickup tube, it is used to illuminate the corner of the measured object when measuring the two-dimensional size of the object; the third lighting system, the third lighting system is installed in a certain part of the probe shell, when measuring the three-dimensional characteristics of the object , for illuminating the measurement surface of the object through the projection grid, the projection lens, the total mirror and the image pickup tube; and a piezoelectric actuator for finely moving the projection grid.

Description

technical field [0001] The present invention relates to an optical measuring instrument for measuring two-dimensional dimensions and three-dimensional characteristics of an object, and more particularly, to a two-dimensional and three-dimensional optical measuring instrument, which can selectively and alternately measure the two-dimensional dimensions and three-dimensional characteristics of a measured object , including surface roughness. Background technique [0002] Generally, with the development of electronics and machinery, the miniaturization and refinement of electronic and mechanical parts are accelerated. Therefore, in order to inspect the process and manufacturing status of miniaturized fine electronic and mechanical parts, it is necessary to measure dimensions, features, and surface roughness with high precision. [0003] The two-dimensional dimensions, three-dimensional features and surface roughness of semiconductor wafers and fine patterns formed on the semic...

AI Technical Summary

Problems solved by technology

but, Figures 1 to 3 A disadvantage of the conventional optical measuring instrument shown is that the first optical system 150 and the second optical system 152b must be selected by turning the turntable 148 forward or backward whenever the measurement parameters, such as two-dimensional dimensions and three-dimensional features, change. , making it inconvenient to use the instrument

[0017] Moreover, the disadvantage of traditional optical measuring instruments is that the image retained on the reference plane may cause measurement errors, making it difficult to ensure the reliability of the measurement results, because the three-dimensional image acquired by the traditional optical measuring instrument CCD is reflected by the reference plane and the measurement surface. The fringes formed by the interference of the light beam

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